TLC59482

SBVS218 – DECEMBER 2012

www.ti.com

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

PACKAGE

ORDERING

TRANSPORT MEDIA,

PRODUCT

DESIGNATOR

NUMBER

QUANTITY

TLC59482DBQR

Tape and Reel, 2500

DBQ

TLC59482DBQ

Tube, 50

TLC59482

TLC59482RGER

Tape and Reel, 3000

TLC59482RGET

Tape and Reel, 250

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this document, or visit the

device product folder at www.ti.com.

(2)

Product preview device.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range, unless otherwise noted.

VALUE

MIN

MAX

UNIT

VCC

–0.3

+6

V

SIN, SCLK, LAT, GSCLK, IREF

–0.3

V

SOUT

–0.3

V

OUT0 to OUT15

–0.3

+11

V

Current

+55

mA

+150

°C

Temperature

–55

+150

°C

Human body model (HBM)

3000

V

Electrostatic discharge (ESD)

ratings

Charged device model (CDM)

2000

V

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltages are with respect to device ground terminal.

THERMAL INFORMATION

TLC59482

DBQ

RGE

UNITS

(SSOP, QSOP)

(QFN)

24 PINS

24 PINS

Junction-to-ambient thermal resistance

86.7

35.5

Junction-to-case (top) thermal resistance

50.4

44

Junction-to-board thermal resistance

10.0

14.7

°C/W

Junction-to-top characterization parameter

13.0

0.4

Junction-to-board characterization parameter

39.7

14.8

Junction-to-case (bottom) thermal resistance

N/A

2.9

(1)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.

2

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