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TLK2201B

TLK2201BI

SLLS585C – NOVEMBER 2003 – REVISED FEBRUARY 2008

Other requirements for thermal lands and thermal vias are detailed in the TI application note PowerPAD

Thermally Enhanced Package Application Report (SLMA002), available via the TI Web pages beginning at URL:

http://www.ti.com.

Figure 13. Example of a Thermal Land

For the TLK2201B, this thermal land must be grounded to the low-impedance ground plane of the device. This

improves not only thermal performance but also the electrical grounding of the device. It is also recommended

that the device ground pin landing pads be connected directly to the grounded thermal land. The land size must

be as large as possible without shorting device signal pins. The thermal land may be soldered to the exposed

PowerPAD using standard reflow soldering techniques.

While the thermal land may be electrically floated and configured to remove heat to an external heat sink, it is

recommended that the thermal land be connected to the low-impedance ground plane for the device. More

information may be obtained from the TI application note PHY Layout (SLLA020).

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