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DS3886AVF Datasheet(PDF) 5 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor.
Part # DS3886AVF
Description  BTL 9-Bit Latching Data Transceiver
PDF  11 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

DS3886AVF Datasheet(HTML) 5 Page - National Semiconductor (TI)

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AC Electrical Characteristics (Note 5) (Continued)
T
A = 0˚C to +70˚C, VCC = 5V ±10%
Symbol
Parameter
Conditions
Min
Typ
Max
Units
RECEIVER
t
PLZ
CD to An
Disable Time
LE = 3.0V
3
5
10
ns
t
PZL
Enable Time
Bn = 2.1V, T/R = 0V
(
Figure 8 and Figure 9)
2.5
6
8
ns
t
PHZ
Disable Time
LE = 3.0V
4
6
8.5
ns
t
PZH
Enable Time
Bn = 1.1V, T/R = 0V
(
Figure 8 and Figure 9)
2.5
5
8.5
ns
t
PLZ
T/R to An
Disable Time
LE = 3.0V, Bn = 2.1V
3
7.5
12
ns
t
PZL
Enable Time
CD = 0V
(
Figure 10 and Figure 11)
5
9.5
15
ns
t
PHZ
Disable Time
LE = 3.0V
3
6
9
ns
t
PZH
Enable Time
Bn = 1.1V, CD = 0V
(
Figure 8 and Figure 9)
36
9
ns
t
skew
LE to An
Same Package
(Note 7)
0.5
3
ns
Bn to An
Same Package
(Note 7)
0.5
2.5
ns
RECEIVER TIMING REQUIREMENTS (
Figure 7)
t
S
Bn to LE
Set-up Time
CD = T/R = 0V
3ns
t
H
LE to Bn
Hold Time
CD = T/R = 0V
1ns
t
pw
LE Pulse Width
CD = T/R = 0V
5ns
PARAMETERS NOT TESTED
C
output
Capacitance at Bn
(Note 8)
5
pF
t
NR
Noise Rejection
(Note 9)
1
ns
Note 6: Input waveforms shall have a rise and fall time of 3 ns.
Note 7: tskew is an absolute value defined as differences seen in propagation delay between drivers in the same package with identical load conditions.
Note 8: The parameter is tested using TDR techniques described in P1194.0 BTL Backplane Design Guide.
Note 9: This parameter is tested during device characterization. The measurements revealed that the part will typically reject 1 ns pulse width.
Note 10: Futurebus+ transceivers are required to limit bus signal rise and fall times to no faster than 0.5 V/ns, measured between 1.3V and 1.8V (approximately 20%
to 80% of nominal voltage swing). The rise and fall times are measured with a transceiver loading equivalent to 12.5
Ω tied to +2.1 V DC.
Pin Description
Pin Name
Number of
Input/
Description
Pins
Output
A0–A8
9
I/O
TTL TRI-STATE receiver output and driver input
ACLK
1
I
Clock input for latch
B0–B8
9
I/O
BTL receiver input and driver output
B0GND–B8GND
9
NA
Driver output ground reduces ground bounce due to high current switching of
driver outputs. (Note 11)
CD
1
I
Chip Disable
GND
2
NA
Ground reference for switching circuits.(Note 10)
LE
1
I
Latch Enable
LI
1
NA
Power supply for live insertion. Boards that require live insertion should connect
LI to the live insertion pin on the connector. (Note 12)
NC
5
NA
No Connect
QGND
1
NA
Ground reference for receiver input bandgap reference and non-switching
circuits. (Note 11)
QV
CC
1NA
V
CC supply for bandgap reference and non-switching circuits. (Note 12)
RBYP
1
I
Register bypass enable
T/R
1
I
Transmit/Receive
—
Transmit (An to Bn)
Receive (Bn to An)
V
CC
2NA
V
CC supply for switching circuits. (Note 12)
Note 11: The multiplicity of grounds reduces the effective inductance of bonding wires and leads, which then reduces the noise caused by transients on the ground
path. The various ground pins can be tied together provided that the external ground has low iductance (i.e., ground plane with power pins and many signal pins con-
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