108

CHARACTERISTICS

CAPACITORS

TANTALUM DIPPED SH

DIMENSIONS (mm)

OUTLINE DRAWING

4

Code

Description

Dimensions/mm

Po

Feed hole pitch

12.7 ± 0.3

P

Hole centre to component centre

6.35 ± 0.4

S

Lead pitch

5.0 + 0.8/-0.2

(2.5 + 0.4/-0.1 option)

H

Height to seating plane

16.0 ± 0.5

Do

Feed hole diameter

4.0 ± 0.2

W

Tape width

18.0 + 1.0/-0.5

Capacitance typically changes with temperature

according to the curve

+20

+10

0

-10

-20

-80 -60 -40 -20

0 +20 +40 +60 +80 +100 +120

Operating Temperature

˚C

DC leakage current (DCL) increases with increasing

Typical Effect of Temperature

upon DC Leakage Current

temperature according to the typical curve

10.0

1.0

0.1

Operating Temperature –˚C

-60 -40 -20

0

+20 +40 +60 +80 +100 +125

Reference 1.0

at + 25 ˚C

Free

Air

Cool

0

1

2

3

4

5

6

25

50

75

100

125

150

175

200

225

250

Entrance to Solder Wave

Exit from Solder Wave

(Time in Wave – 2 to 4 Secs.)

Hot Air Debridging

Preheat Zone

Flux Zone

Entrance

to Solder

Machine

Time (Minutes)

80°C

to 120 °C

Solder Wave Peak

Temperature 260 °C

Exit from

In-Line Cleaner

(time in cleaner

may be less)

Immersion in

Cleaning

Vapor

Top Side

Nominal

150°C

Max.

Free

Air

Cool

Entrance to

In-Line Cleaner

Exit from

Solder

Machine

Bottom Side

Temperature

Range

Optimum Solder Wave Profile

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