HV2802/HV2902

DS20005449A-page 18

 2015 Microchip Technology Inc.

Microchip Technology Drawing C04-371A Sheet 2 of 2

For the most current package drawings, please see the Microchip Packaging Specification located at

http://www.microchip.com/packaging

Note:

C

NX Øb

Ø0.15

C A B

Ø0.05

C

SOLDER BALL

DETAIL A

A1

0.10 C

0.08 C

DETAIL A

Number of Pins

Overall Height

Ball Diameter

Overall Width

Overall Length

Overall Ball Pitch

Overall Ball Pitch

Molded Cap Thickness

Pitch

Standoff

Units

Dimension Limits

A1

A

Øb

D

E1

D1

A3

e

E

N

0.65 BSC

0.50

0.25

-

0.15

0.30

9.00 BSC

7.80 BSC

7.80 BSC

-

0.20

9.00 BSC

MILLIMETERS

MIN

NOM

78

0.35

1.00

0.25

MAX

REF: Reference Dimension, usually without tolerance, for information purposes only.

BSC: Basic Dimension. Theoretically exact value shown without tolerances.

1.

2.

Notes:

Pin 1 visual index feature may vary, but must be located within the hatched area.

Dimensioning and tolerancing per ASME Y14.5M

0.45

0.55

78-Ball Very Thin Fine Pitch Ball Grid Array (5G) - 9x9x1.0 mm Body [VFBGA]