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ISO7831FDWR Datasheet(PDF) 31 Page - Texas Instruments |
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ISO7831FDWR Datasheet(HTML) 31 Page - Texas Instruments |
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31 / 37 page  www.ti.com EXAMPLE BOARD LAYOUT 14X (1.27) (16.25) 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND 16X (0.6) 16X (2) (14.25) (14.5) 16X (1.875) 16X (0.6) (16.375) 14X (1.27) SOIC - 2.65 mm max height DWW0016A PLASTIC SMALL OUTLINE 4221501/A 11/2014 SYMM SYMM LAND PATTERN EXAMPLE STANDARD SCALE:3X 1 8 9 16 NOTES: (continued) 5. Publication IPC-7351 may have alternate designs. 6. Solder mask tolerances between and around signal pads can vary based on board fabrication site. METAL OPENING SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK DETAILS SOLDER MASK METAL UNDER SOLDER MASK OPENING SOLDER MASK DEFINED PCB CLEARANCE & CREEPAGE OPTIMIZED LAND PATTERN EXAMPLE SCALE:3X SYMM SYMM 1 8 9 16 31 ISO7831, ISO7831F www.ti.com SLLSEP8B – JULY 2015 – REVISED JUNE 2016 Product Folder Links: ISO7831 ISO7831F Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated |
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