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ISO7831, ISO7831F

SLLSEP8B – JULY 2015 – REVISED JUNE 2016

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(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

ISO7831

UNIT

DW (SOIC)

DWW (SOIC)

16 PINS

16 PINS

Junction-to-ambient thermal resistance

81.1

83.4

°C/W

Junction-to-case(top) thermal resistance

43.8

45.2

°C/W

Junction-to-board thermal resistance

45.7

54.1

°C/W

Junction-to-top characterization parameter

17.0

17.6

°C/W

Junction-to-board characterization parameter

45.2

53.3

°C/W

Junction-to-case(bottom) thermal resistance

—

—

°C/W

6.5 Power Rating

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

Maximum power dissipation

cycle square wave

150

mW

Maximum power dissipation by side-1

50

mW

Maximum power dissipation by side-2

100

mW