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High reliability test capabilities

1. Solder Resistance

2. Solderability

3. Pull Test

4. Bend Lead

5. High Temperature Reverse Bias

6. Pressure Cooker

7. Temperature Cycling

8. Thermal Shock

9. Humidity

10. High Temperature Storage Life

at 260±5

for 10±2sec.

immerse body into solder 1/16"±1/32"

o

at 245±5 C for 5 sec.

1kg in axial lead direction for 10 sec.

1kg weight applied to each lead bending

o

o

arc 90 ±5 for 3 times.

o

V =80% rate at T =150 C for 168 hrs.

R

J

o

15P

at T =121 C for 4 hrs.

SIG

A

o

o

-55 C to +125 C dwelled for 30 min.

and transferred for 5min. total 10 cycles.

o

o

0 C for 5 min. rise to 100 C for 5 min. total 10 cycles.

o

at T =85 C, RH=85% for 1000hrs.

A

o

at 175 C for 1000 hrs.

MIL-STD-750D

METHOD-2031

MIL-STD-202F

METHOD-208

MIL-STD-750D

METHOD-2036

MIL-STD-750D

METHOD-2036

MIL-STD-750D

METHOD-1038

JESD22-A102

MIL-STD-750D

METHOD-1051

MIL-STD-750D

METHOD-1056

MIL-STD-750D

METHOD-1021

MIL-STD-750D

METHOD-1031

Item Test

Conditions

Reference

http://www.formosams.com/

TEL:886-2-22696661

FAX:886-2-22696141

Formosa MS

Zener Diode

Document ID

Issued Date

Revised Date

Revision

Page.

DS-222716

2008/02/10

2010/03/10

B

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Z100B THRU Z330B