OM6206USLASHZ datasheet(28/36 Pages) PHILIPS

28 / 36 page

2001 Nov 14

Philips Semiconductors

Product speciﬁcation

× 102 pixels matrix LCD driver

OM6206

Note

1. All x/y coordinates (in

µm) are referenced to the centre

of the chip (see Fig.20).

Table 9

Bonding pad dimensions

VSS2

212

−430

+935

VSS2

213

−510

+935

VSS1

214

−670

+935

VSS1

215

−750

+935

VSS1

216

−830

+935

VSS1

217

−910

+935

218

−1150

+935

219

−1630

+935

220

−2030

+935

VSS1

221

−2110

+935

VSS1

222

−2190

+935

223

−2270

+935

VLCDIN

224

−2510

+935

VLCDIN

225

−2590

+935

VLCDIN

226

−2670

+935

VLCDIN

227

−2750

+935

VLCDIN

228

−2830

+935

VLCDIN

229

−2910

+935

VLCDOUT

230

−3070

+935

VLCDOUT

231

−3150

+935

VLCDOUT

232

−3230

+935

VLCDOUT

233

−3310

+935

VLCDOUT

234

−3390

+935

VLCDOUT

235

−3470

+935

VLCDOUT

236

−3550

+935

VLCDSENSE

237

−3630

+935

Alignment marks

Circle 1

−5185

−910

Circle 2

+5185

−910

Circle 3

+4160

+910

Circle 4

−4160

+910

SYMBOL

PAD

COORDINATES(1)

NAME

DIMENSION

Pad pitch

µm

Pad size, aluminium

× 100 µm

Bump dimensions

× 90 × 17.5 (±5) µm

Wafer thickness (including

bumps)

maximum 430

µm

Wafer thickness (without

bumps)

typical 380

µm

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