2001 Nov 14

32

Philips Semiconductors

Product specification

65

× 102 pixels matrix LCD driver

OM6206

16 TRAY INFORMATION

handbook, full pagewidth

MGT885

D

C

A

x

y

F

E

H

G

B

Fig.21 Tray details.

handbook, halfpage

MGT886

Fig.22 Tray alignment.

The orientation of the IC in a pocket is indicated by the position of the IC type name on the die surface with respect to the chamfer on the upper left

corner of the tray. Refer to the bonding pad location diagram for the orientating and position of the type name on the die surface.