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DMN1019USN Datasheet(PDF) 2 Page - Diodes Incorporated

Part # DMN1019USN
Description  12V N-CHANNEL ENHANCEMENT MODE MOSFET
PDF  6 Pages
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Manufacturer  DIODES [Diodes Incorporated]
Direct Link  http://www.diodes.com
Logo DIODES - Diodes Incorporated

DMN1019USN Datasheet(HTML) 2 Page - Diodes Incorporated

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DMN1019USN
Document number: DS36999 Rev. 2 - 2
2 of 6
www.diodes.com
May 2014
© Diodes Incorporated
DMN1019USN
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Units
Drain-Source Voltage
VDSS
12
V
Gate-Source Voltage
VGSS
±8
V
Continuous Drain Current (Note 6) VGS = 4.5V
Steady
State
TA = +25°C
TA = +70°C
ID
9.3
7.4
A
t<10s
TA = +25°C
TA = +70°C
ID
11
8.8
A
Pulsed Drain Current (10µs pulse, duty cycle = 1%)
IDM
70
A
Maximum Body Diode Forward Current (Note 6)
IS
2
A
Thermal Characteristics
Characteristic
Symbol
Value
Units
Total Power Dissipation (Note 5)
TA = +25°C
PD
0.68
W
TA = +70°C
0.4
Thermal Resistance, Junction to Ambient (Note 5)
Steady state
RθJA
160
°C/W
t<10s
115
°C/W
Total Power Dissipation (Note 6)
TA = +25°C
PD
1.2
W
TA = +70°C
0.83
Thermal Resistance, Junction to Ambient (Note 6)
Steady state
RθJA
96
°C/W
t<10s
68
°C/W
Thermal Resistance, Junction to Case (Note 6)
RθJC
18
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-55 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Min
Typ
Max
Unit
Test Condition
OFF CHARACTERISTICS (Note 7)
Drain-Source Breakdown Voltage
BVDSS
12
—
—
V
VGS = 0V, ID = 250µA
Zero Gate Voltage Drain Current
IDSS
—
—
1
µA
VDS =12V, VGS = 0V
Gate-Body Leakage
IGSS
—
—
±2
µA
VGS = ±8V, VDS = 0V
ON CHARACTERISTICS (Note 7)
Gate Threshold Voltage
VGS(th)
0.35
0.53
0.8
V
VDS = VGS, ID = 250µA
Static Drain-Source On-Resistance
RDS(ON)
—
7
10
mΩ
VGS = 4.5V, ID = 9.7A
—
8
12
VGS = 2.5V, ID = 9A
—
10
14
VGS = 1.8V, ID = 8.1A
—
14
18
VGS = 1.5V, ID = 4.5A
—
28
41
VGS = 1.2V, ID = 2.4A
Forward Transfer Admittance
IYfsI
—
28
—
S
VDS = 4V, ID = 9.7A
Diode Forward Voltage
VSD
—
0.8
1.2
V
VGS = 0V, IS = 10A
DYNAMIC CHARACTERISTICS (Note 8)
Input Capacitance
Ciss
—
2426
—
pF
VDS = 10V, VGS = 0V,
f = 1MHz
Output Capacitance
Coss
—
396
—
pF
Reverse Transfer Capacitance
Crss
—
375
—
pF
Gate Resistance
Rg
—
1.1
—
Ω
VDS = 0V, VGS = 0V, f = 1MHz
Total Gate Charge (VGS = 8V)
Qg
—
50.6
—
nC
VDS = 4V, ID = 10A
Total Gate Charge (VGS = 4.5V)
Qg
—
27.3
—
Gate-Source Charge
Qgs
—
3.4
—
Gate-Drain Charge
Qgd
—
5.2
—
Turn-On Delay Time
tD(ON)
—
7.6
—
ns
VDD = 4V, VGEN = 5V, ID = 10A,
RG = 1Ω, RL = 0.4Ω
Turn-Off Delay Time
tD(OFF)
—
22.2
—
ns
Turn-On Rise Time
tr
—
57.6
—
ns
Turn-Off Fall Time
tf
—
16.8
—
ns
Notes:
5. Device mounted on FR-4 PCB with minimum recommended pad layout, single sided. The power dissipation PD is based on t<10s RθJA.
6. Device mounted on 1” x 1” FR-4 PCB with high coverage 2 oz. Copper, single sided. The power dissipation PD is based on t<10s RθJA.
7. Short duration pulse test used to minimize self-heating effect.
8. Guaranteed by design. Not subject to production testing.



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