TAS5121

SLES086A − NOVEMBER 2003 − REVISED MARCH 2004

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2

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during

storage or handling to prevent electrostatic damage to the MOS gates.

GENERAL INFORMATION

Terminal Assignment

The TAS5121 is offered in a thermally enhanced 36-pin

PSOP3 (DKD) package. The DKD package has the

thermal pad on top.

1

2

3

4

5

6

7

8

9

10

11

12

13

14

15

16

17

18

36

35

34

33

32

31

30

29

28

27

26

25

24

23

22

21

20

19

GND

PWM_BP

GND

RESET

DREG_RTN

GVDD

M3

DREG

DGND

M1

M2

DVDD

SD

DGND

OTW

GND

PWM_AP

GND

GVDD_B

GVDD_B

GND

BST_B

PVDD_B

PVDD_B

OUT_B

OUT_B

GND

GND

OUT_A

OUT_A

PVDD_A

PVDD_A

BST_A

GND

GVDD_A

GVDD_A

DKD PACKAGE

(TOP VIEW)

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(1)

TAS5121

UNITS

DVDD TO DGND

–0.3 V to 4.2 V

GVDD_x TO GND

14.2 V

PVDD_X TO GND (dc voltage)

33.5 V

PVDD_X TO GND(2))

48 V

OUT_X TO GND (dc voltage)

33.5 V

OUT_X TO GND(2))

48 V

BST_X TO GND (DC voltage)

46 V

BST_X TO GND(2))

53 V

PWM_XP, RESET, M1, M2, M3, SD,

OTW

–0.3 V to DVDD + 0.3 V

Maximum junction temperature range,

TJ

–40

°C to 150°C

Storage temperature

–40

°C to 125°C

(1) Stresses beyond those listed under “absolute maximum ratings”

may cause permanent damage to the device. These are stress

ratings only, and functional operation of the device at these or any

other conditions beyond those indicated under “recommended

operating conditions” is not implied. Exposure to absolute-

maximum-rated conditions for extended periods may affect device

reliability.

(2) The duration should be less than 100 ns (see application note

SLEA025).

ORDERING INFORMATION

TA

PACKAGE

TRANSPORT

MEDIA

DESCRIPTION

0

°C to 70°C

TAS5121DKD

Tube

36-pin PSOP3

0

°C to 70°C TAS5121DKDR

Tape and reel

36-pin PSOP3

PACKAGE DISSIPATION RATINGS

PACKAGE

RθJC

(

°C/W)

RθJA

(

°C/W)

36-Pin DKD PSOP3

0.85

See Note 1

(1) The TAS5121 package is thermally enhanced for conductive

cooling using an exposed metal pad area. It is impractical to use the

devices with the pad exposed to ambient air as the only heat sinking

of the device.

For this reason, RθJA, a system parameter that characterizes the

thermal treatment, is provided in the Application Information section

of the data sheet. An example and discussion of typical system

RθJA values are provided in the Thermal Information section. This

example provides additional information regarding the power

dissipation ratings. This example should be used as a reference to

calculate the heat dissipation ratings for a specific application.