TPS40052

SLUS563B − AUGUST 2003 − REVISED APRIL 2004

2

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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

ORDERING INFORMATION

TA

PACKAGE

PART NUMBER

−40

°C to 85°C

Plastic HTSSOP(PWP)(1)

TPS40052PWP

(1) The PWP package is also available taped and reeled. Add an R suffix to the device type

(i.e., TPS40052PWPR). See the application section of the data sheet for PowerPAD

drawing and layout information.

ABSOLUTE MAXIMUM RATINGS

over operating free-air temperature range unless otherwise noted(2)

TPS40052

UNIT

VIN

45

Input voltage range, VIN

VFB, SS, SYNC, EA_REF

−0.3 to 6

Input voltage range, VIN

SW

−0.3 to 45

V

SW, transient < 50 ns

−2.5

V

Output voltage range, VO

COMP, RT, SS

−0.3 to 6

Output current, IOUT

RT

200

µA

Operating junction temperature range, TJ

−40 to 125

Storage temperature, Tstg

−55 to 150

°C

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

C

(2) Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only,

and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is

not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

RECOMMENDED OPERATING CONDITIONS

MIN

NOM

MAX

UNIT

Input voltage, VI

10

40

V

Operating free-air temperature, TA

−40

85

°C

THERMAL

PAD

1

2

3

4

5

6

7

8

16

15

14

13

12

11

10

9

SYNC

RT

BP5

EA_REF

SGND

SS/SD

VFB

COMP

ILIM

VIN

BOOST

HDRV

SW

BP10

LDRV

PGND

PWP PACKAGE(3)(4)

(TOP VIEW)

(3) For more information on the PWP package, refer to TI Technical Brief, Literature No. SLMA002.

(4) PowerPADt heat slug must be connected to SGND (pin 5) or electrically isolated from all other pins.