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DLP9000

DLPS036B – SEPTEMBER 2014 – REVISED OCTOBER 2016

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Copyright © 2014–2016, Texas Instruments Incorporated

Table of Contents

1

Features .................................................................. 1

2

Applications ........................................................... 1

3

Description ............................................................. 1

4

Revision History..................................................... 2

5

Description (continued)......................................... 4

6

Pin Configuration and Functions ......................... 4

7

Specifications....................................................... 11

7.1

Absolute Maximum Ratings .................................... 11

7.2

Storage Conditions.................................................. 12

7.3

ESD Ratings............................................................ 12

7.4

Recommended Operating Conditions ..................... 12

7.5

Thermal Information ................................................ 14

7.6

Electrical Characteristics......................................... 14

7.7

Timing Requirements .............................................. 16

7.8

Capacitance at Recommended Operating

Conditions ................................................................ 21

7.9

Typical Characteristics ............................................ 21

7.10

System Mounting Interface Loads ........................ 22

7.11

Micromirror Array Physical Characteristics .......... 22

7.12

Micromirror Array Optical Characteristics ............. 24

7.13

Optical and System Image Quality........................ 25

7.14

Window Characteristics......................................... 25

7.15

Chipset Component Usage Specification ............. 25

8

Parameter Measurement Information ................ 26

9

Detailed Description ............................................ 27

9.1

Overview ................................................................. 27

9.2

Functional Block Diagram ....................................... 28

9.3

Feature Description................................................. 29

9.4

Device Functional Modes........................................ 32

9.5

Window Characteristics and Optics ....................... 32

9.6

Micromirror Array Temperature Calculation............ 33

9.7

Micromirror Landed-On/Landed-Off Duty Cycle ..... 34

10

Application and Implementation........................ 37

10.1

Application Information.......................................... 37

10.2

Typical Applications .............................................. 37

11

Power Supply Requirements ............................. 40

11.1

DMD Power Supply Requirements ...................... 40

11.2

DMD Power Supply Power-Up Procedure ........... 40

11.3

DMD Mirror Park Sequence Requirements .......... 41

11.4

DMD Power Supply Power-Down Procedure ...... 41

12

Layout................................................................... 44

12.1

Layout Guidelines ................................................. 44

12.2

Layout Example .................................................... 46

13

Device and Documentation Support ................. 50

13.1

Device Support...................................................... 50

13.2

Documentation Support ........................................ 51

13.3

Community Resources.......................................... 51

13.4

Trademarks ........................................................... 52

13.5

Electrostatic Discharge Caution ............................ 52

13.6

Glossary ................................................................ 52

14

Mechanical, Packaging, and Orderable

Information ........................................................... 52

14.1

Thermal Characteristics ........................................ 52

14.2

Package Thermal Resistance ............................... 52

14.3

Case Temperature ................................................ 52

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision A (October 2015) to Revision B

Page

•

Separated TCASE into TARRAY and TWINDOW. Changed TGRADIENT to TDELTA. Reduce DCLK_A,B,C,D for

DLP9000 in Absolute Maximum Ratings. ............................................................................................................................. 11

•

Separated Tstg into Tdmd and RH in Storage Conditions. .................................................................................................. 12

•

Changed TDMD to TARRAY and TGRADIENT to TDELTA, added short term operational, and updated temperature

values in Recommended Operating Conditions. .................................................................................................................. 13

•

Added the four modes of operation. ..................................................................................................................................... 21

•

Removed the column showing the pixel data rate and added the pattern mode pattern rates............................................ 21

•

Updated CL2w constant in Micromirror Array Temperature Calculation. ............................................................................. 33

•

Added recommended idle mode operation for maximizing mirror useful life. ...................................................................... 34

•

Updated Micromirror Derating Curve.................................................................................................................................... 34

•

Added mirror park sequence requirements. ......................................................................................................................... 41

•

Updated device nomenclature and markings. ...................................................................................................................... 51

Changes from Original (September 2014) to Revision A

Page

•

Updated title .......................................................................................................................................................................... 1

•

Updated Features, Description, and Device Information to include DLP9000XFLS DMD..................................................... 1

•

Added DLP9000XFLS application diagram. ........................................................................................................................... 1