RT9168 datasheet(9/13 Pages) ETC

9 / 13 page

RT9168/A

DS9168/A-03 May 2001

www.richtek-ic.com.tw

indefinite amount of time without damaging the part by

cooperation of current limit and thermal protection.

Operating Region and Power Dissipation

The maximum power dissipation of RT9168/A depends

on the thermal resistance of the case and circuit board,

the temperature difference between the die junction

and ambient air, and the rate of airflow. The power

dissipation across the device is P = IOUT (VIN - VOUT).

The maximum power dissipation is: PMAX = (TJ - TA)

θJA

where TJ - TA is the temperature difference between

the RT9168/A die junction and the surrounding

environment,

θJA is the thermal resistance from the

junction to the surrounding environment. The GND pin

of the RT9168/A performs the dual function of

providing an electrical connection to ground and

channeling heat away. Connect the GND pin to ground

using a large pad or ground plane.

RT9168 Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers