CAT25M02

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13

PACKAGE DIMENSIONS

WLCSP8, 3.12x2.04

CASE 567NM

ISSUE O

SEATING

PLANE

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. COPLANARITY APPLIES TO THE SPHERICAL

CROWNS OF THE SOLDER BALLS.

4. DIMENSION b IS MEASURED AT THE MAXIMUM

BALL DIAMETER PARALLEL TO DATUM C.

DIM

A

MIN

MAX

−−−

MILLIMETERS

A1

b

0.22

0.32

e

1.40 BSC

0.58

E

D

A B

PIN A1

REFERENCE

8X

b

4

C

B

A

A1

C

0.16

0.22

0.270

8X

DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

TOP VIEW

SIDE VIEW

BOTTOM VIEW

A2

0.33 REF

RECOMMENDED

PACKAGE

OUTLINE

12

3

A

e1

e1

1.00 BSC

e2

e3

2.10 BSC

1.10 BSC

D

e

e2

e3

D

E

0.06 C

0.06 C

2X

2X

0.08 C

0.10 C

NOTE 3

A

0.05 C

NOTE 3

B

0.03 C

e1/2

e/2

2.04 BSC

3.12 BSC

2.100

1.000

1.400

0.700

1.100

PIN A1

REFERENCE

A1

A2