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PCA9504ADGG Datasheet(PDF) 2 Page - NXP Semiconductors

Part # PCA9504ADGG
Description  Glue chip 4
PDF  29 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

PCA9504ADGG Datasheet(HTML) 2 Page - NXP Semiconductors

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Philips Semiconductors
Product data
PCA9504A
Glue chip 4
2
2004 May 11
FEATURES
• Dual, Strapping, Selectable Feature Sets
• Audio-disable Circuit
• Mute Audio Circuit
• 5 V reference generation
• 5 V standby reference generation
• HD single color LED driver
• IDE reset signal generation/PCIRST# buffers
• PWROK (PWRGD_3V) signal generation
• Power Sequencing / BACKFEED_CUT
• Power Supply turn on circuitry
• RMSRST# generation
• Voltage translation for DDC to VGA monitor
• HSYNCH / VSYNCH voltage translation to VGA monitor
• 3-state buffers for test
• Extra GP Logic gates
• Power LED Drivers
• Flash FLUSH# / INIT# circuit
• 5 V I2C to 3.3 V SMBus conversion to 400 kHz
• Requires both 3.3 V and 5.0 V operating voltages
• 0 to +70 °C operating temperature range
• ESD protection exceeds 1000 V HBM per JESD22-A114 and
750 V CDM per JESD22-C101
• Latch-up testing is done to JEDEC Standard JESD78 which
exceeds 100 mA
• Package offered: TSSOP56
DESCRIPTION
The PCA9504A Glue Chip 4 is a highly integrated and cost-efficient
custom ASIC that reduces logic part count, overall component cost,
and board space requirements for PC designers and manufacturers.
The Glue Chip 4 supports the latest generation of high-volume
platforms based on Intel
® processors and chipsets that require
additional external circuitry in order to function properly. It is used on
entry servers/workstations (840 and 860 chipsets), high-end
desktops (820 and 850 chipsets), as well as mid range (815, 830
and 845 chipsets) and low-end (810 chipset) motherboards. Some
of these functionalities include meeting timing specifications,
buffering signals, and switching between power wells.
The PCA9504A Glue Chip 4 integrates miscellaneous motherboard
logic and analog functions into a single, small footprint 56-pin
TSSOP device. The Glue Chip 4 typically resides on the
motherboard close to the I/O controller Hub (ICH) and is optimized
for the Intel 82801BA I/O controller hub (ICH2).
PIN CONFIGURATION
SW00578
1
2
3
4
5
6
7
8
9
10
11
12
45
46
47
48
49
50
51
52
53
54
55
56
VREF3IN
V_3P3_STBY
GPO_FLUSH_CACHE/GP1_IN
A20M/GP1_INB
INIT/GP1_INA
FLUSH_OUT_CPU/GP1_OUT
INIT_OUT/GP2_OUT
CLK_IN
SEL_33_66
GND
GP3_OUT
GP3_IN
STRAP
VCCP_VREF
VSYNC_5V
HSYNC_5V
VSYNC_3V
REF5V_STBY
HSYNC_3V
AUD_SHDN
MUTE_AUD
VREF5IN
PCIRST
13
14
15
16
17
18
39
40
41
42
43
44
PCRIST_OUT
AUD_EN
AUD_RST
IDE_RSTDRV
3V_DDCSCL
REF5V
RSMRST
GND
TEST_EN
GRN_LED
5V_DDCSCL
19
38
YLW_LED
3V_DDCSDA
20
21
22
23
24
25
32
33
34
35
36
37
5V_DDCSDA
CPU_PRESENT
SLP_S3
PS_ON
HD_LED
YLW_BLNK
SCK_BJT_GATE
GRN_BLNK
PWRGD_3V
FPRST
PWRGD_PS
PRIMARY_HD
26
31 FLUSH_OUT_FWH
SCSI
27
30 LATCHED_BACKFED_CUT
SECONDARY_HD
28
29
BACKFEED_CUT
GND
V_5P0_STBY
SLP_S5
ORDERING INFORMATION
PACKAGE
TEMPERATURE RANGE
ORDER CODE
TOPSIDE MARK
DRAWING NUMBER
56-Pin Plastic TSSOP
0
°C to +70 °C
PCA9504ADGG
PCA9504ADGG
SOT364-1
Standard packing quantities and other packaging data are available at www.philipslogic.com/packaging.



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