TSB41AB1 datasheet(13/60 Pages) TI

13 / 60 page

TSB41AB1

IEEE 1394a2000 ONEPORT CABLE

TRANSCEIVER/ARBITER

SLLS423G − JUNE 2000 − REVISED OCTOBER 2003

POST OFFICE BOX 655303

• DALLAS, TEXAS 75265

absolute maximum ratings over operating free-air temperature (unless otherwise noted)†

Supply voltage range, VDD (see Note 1)

−0.3 V to 4 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Input voltage range, VI

−0.5 V to VDD + 0.5 V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Output voltage range at any output, VO

−0.5 V to VDD + 0.5V

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Continuous total power dissipation

See Dissipation Rating Table

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Operating free air temperature, TA

°C to 70°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Storage temperature range, Tstg

−65

°C to 150°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds

260

°C

. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .

† Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and

functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied.

Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

NOTES:

1. All voltage values, except differential I/O bus voltages, are with respect to network ground.

DISSIPATION RATING TABLE

PACKAGE

TA ≤ 25°C

POWER RATING

DERATING FACTOR‡

ABOVE TA = 25°C

TA = 70°C

POWER RATING

PAP§

4.78 W

38 mW/

°C

3.06 W

PAP¶

2.13 W

17 mW/

°C

1.36 W

PAP#

2.08 W

16 mW/

°C

1.33 W

PHP§

3.92 W

31.4 mW/

°C

2.51 W

PHP¶

1.9 W

10.4 mW/

°C

1.22 W

PHP#

1.45 W

11 mW/

°C

0.93 W

GQE||

0.82 W

9.6 mW/

°C

0.38 W

GQE#

0.59 W

6.9 mW/

°C

0.28 W

‡ This is the inverse of the traditional junction-to-ambient thermal resistance (RθJA).

§ 1 oz. trace and copper pad with solder

¶ 1 oz. trace and copper pad without solder

# Standard JEDEC low-K board

|| Standard JEDEC high-K board

For more information, refer to TI technical brief PowerPAD Thermally Enhanced Package, TI literature number

SLMA002.

PowerPAD is a trademark of Texas Instruments.

TSB41AB1 Datasheet(PDF) 13 Page - Texas Instruments

TSB41AB1 Datasheet(HTML) 13 Page - Texas Instruments

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