LM26 datasheet(6/20 Pages) NSC

6 / 20 page

Electrical Characteristics (Continued)

Unless otherwise specified, V

IN = 15V, GND = PGND = 0V, VLIN5 = VDD1 = VDD2. Limits appearing in boldface type apply

over the specified operating junction temperature range, (-20˚C to +125˚C, if not otherwise specified). Specifications appearing

in plain type are measured using low duty cycle pulse testing with T

A = 25˚C (Note 6), (Note 7). Min/Max limits are guaranteed

by design, test, or statistical analysis.

Symbol

Parameter

Conditions

Min

Typ

Max

Units

FB1,IFB2

Feedback Input Bias

Current

FB1_FIX = 1.5V, VFB2_FIX = 1.5V

±200

comp1_SC,

comp2_SC

COMP Output Source

Current

FB1_FIX =VFB2_FIX = 1V,

COMP1 =VCOMP2 =1V

113

µA

0˚C to 125˚C

-40˚C to 125˚C

comp1_SK,

comp2_SK

COMP Output Sink

Current

FB1_FIX =VFB2_FIX = 1.5V and

COMP1 =VCOMP2 = 0.5V

108

µA

0˚C to 125˚C

-40˚C to 125˚C

gm1, gm2

Transconductance

650

µmho

SNS1,

SNS2

Current Sense Amplifier

(1&2) Gain

COMPx = 1.25V

4.2

5.2

7.5

Voltage References and Linear Voltage Regulators

UVLO

VLIN5 Under-voltage

Lockout

Threshold Rising

ON/SS1, ON/SS2 transition

from low to high

3.6

4.0

4.4

Logic Outputs

PGOOD Low Sink

Current

PGOOD = 0.4V

0.60

0.95

PGOOD High Leakage

Current

PGOOD =5V

200

Note 1: Absolute maximum ratings indicate limits beyond which damage to the device may occur. Operating Range indicates conditions for which the device is

intended to be functional, but does not guarantee specfic performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics.

The guaranteed specifications apply only for the test conditions. Some performance characteristics may degrade when the device is not operated under the listed

test conditions.

Note 2: ON/SS1 and ON/SS2 are internally pulled up to one diode drop above VLIN5. Do not apply an external pull-up voltage to these pins. It may cause damage

to the IC.

Note 3: The maximum allowable power dissipation is calculated by using PDMAX =(TJMAX -TA)/θJA, where TJMAX is the maximum junction temperature, TA is the

ambient temperature and

θJA is the junction-to-ambient thermal resistance of the specified package. The 1.1W rating results from using 125˚C, 25˚C, and 90.6˚C/W

for TJMAX,TA, and θJA respectively. A θJA of 90.6˚C/W represents the worst-case condition of no heat sinking of the 28-pin TSSOP. A thermal shutdown will occur

if the temperature exceeds the maximum junction temperature of the device.

Note 4: For detailed information on soldering plastic small-outline packages, refer to the Packaging Databook available from National Semiconductor Corporation.

Note 5: For testing purposes, ESD was applied using the human-body model, a 100pF capacitor discharged through a 1.5k

Ω resistor.

Note 6: A typical is the center of characterization data measured with low duty cycle pulse tsting at TA = 25˚C. Typicals are not guaranteed.

Note 7: All limits are guaranteed. All electrical characteristics having room-temperature limits are tested during production with TA =TJ = 25˚C. All hot and cold limits

are guaranteed by correlating the electrical characteristics to process and temperature variations and applying statistical process control.

Note 8: Both switching controllers are off. The linear regulator VLIN5 remains on.

Note 9: When SS1 and SS2 pins are charged above this voltage and either of the output voltages at Vout1 or Vout2 is still below the regulation limit, the under

voltage protection feature is initialized.

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