PCM1803 datasheet(3/20 Pages) TI

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DEVICE INFORMATION

ABSOLUTE MAXIMUM RATINGS

PCM1803

SLES125 – NOVEMBER 2004

TERMINAL FUNCTIONS

TERMINAL

I/O

DESCRIPTION

NAME

NO.

AGND

–

Analog GND

BCK

I/O

Audio data bit clock input/output(1)

BYPAS

HPF bypass control. LOW: Normal mode (dc reject); HIGH: Bypass mode (through)(2)

DGND

–

Digital GND

DOUT

Audio data digital output

FMT0

Audio data format select input 0. See Data Format section.(2)

FMT1

Audio data format select input 1. See Data Format section.(2)

LRCK

I/O

Audio data latch enable input/output (1)

MODE0

Mode select input 0. See Data Format section. (2)

MODE1

Mode select input 1. See Data Format section. (2)

OSR

Oversampling ratio select input. LOW:

×64 f

S, HIGH: ×128 fS

(2)

PDWN

Power-down control, active-low (2)

SCKI

System clock input: 256 fS, 384 fS, 512 fS or 768 fS (3)

TEST

Test, must be connected to DGND (2)

VCC

–

Analog power supply, 5-V

VDD

–

Digital power supply, 3.3-V

VINL

Analog input, L-channel

VINR

Analog input, R-channel

VREF1

–

Reference-voltage-1 decoupling capacitor

VREF2

–

Reference-voltage-2 decoupling capacitor

(1)

Schmitt-trigger input

(2)

Schmitt-trigger input with internal pulldown (50 k

Ω typically), 5-V tolerant

(3)

Schmitt-trigger input, 5-V tolerant

over operating free-air temperature range (unless otherwise noted)(1)

Supply voltage

VCC

–0.3 V to 6.5 V

Supply voltage

VDD

–0.3 V to 4 V

Ground voltage differences

AGND, DGND

±0.1 V

Digital input voltage, VI

LRCK, BCK, DOUT

–0.3 V to (VDD + 0.3 V) < 4 V

Digital input voltage, VI

PDWN, BYPAS, TEST, SCKI, OSR, FMT0,

–0.3 V to 6.5 V

FMT1, MODE0, MODE1

Analog input voltage, VI

VINL, VINR, VREF1, VREF2

–0.3 V to (VCC + 0.3 V) < 6.5 V

Input current, II

Any pins except supplies

±10 mA

Ambient temperature under bias, Tbias

–40

°C to 125°C

Storage temperature, Tstg

–55

°C to 150°C

Junction temperature, TJ

150

°C

Lead temperature (soldering)

260

°C, 5 s

Package temperature (IR reflow, peak)

260

°C

(1)

Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

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