4

4 - 11

For price, delivery, and to place orders, please contact Hittite Microwave Corporation:

20 Alpha Road, Chelmsford, MA 01824 Phone: 978-250-3343 Fax: 978-250-3373

Order On-line at www.hittite.com

Absolute Maximum Ratings

LO Drive

+27 dBm

Storage Temperature

-65 to +150 °C

Operating Temperature

-55 to +85 °C

MxN Spurious @ IF Port

nLO

mRF

0

1234

0xx

13.66

26.83

9.16

38.33

18.160

31.33

49.33

43.5

2

78.5

80.16

75.16

79.16

76.66

376.0

80.0

81.16

64.5

78.66

4

73.83

77.83

80.0

81.83

82.0

RF Freq. = 6.1 GHz @ -10 dBm

LO Freq. = 6.0 GHz @ +13 dBm

Measured as downconverter

Outline Drawing

NOTES:

1. ALL DIMENSIONS ARE IN INCHES [MM]

2. BOND PADS ARE .004” SQUARE

3. TYPICAL BOND PAD SPACING CENTER TO CENTER

.1 IS .006” EXCEPT AS SHOWN

4. DIE THICKNESS = .004” [.100 MM]

5. BACKSIDE METALIZATION: GOLD

6. BACKSIDE METAL IS GROUND

7. BOND PAD METALIZATION: GOLD

Standard

Alternate

WP-3 (Waffle Pack)

[2]

[1] Refer to the “Packaging Information” section for die

packaging dimensions.

[2] For alternate packaging information contact Hittite

Microwave Corporation.

HMC129

v04.1007

GaAs MMIC DOUBLE-BALANCED

MIXER, 4 - 8 GHz