MLX90290

High Speed Programmed Linear Hall IC

2.75 BSC

1.60 BSC

0.88

+0.02

- 0.03

1.00 MAX

0.075

+0.025

- 0.050

SEATING PLANE

0.575 REF.

0.40

+/-0.10

0.50 BSC

WITH PLATING

~

BASE METAL

SECTION B-B’

B

B’

Notes:

1. All dimensions are in millimeters

2. Outermost plastic extreme width does not include mold flash or

protrusions. Mold flash and protrusions shall not exceed

0.15mm per side.

3. Outermost plastic extreme length does not include mold flash

or protrusions. Mold flash and protrusions shall not exceed

0.25mm per side.

4. The lead width dimension does not include dambar protrusion.

Allowable dambar protrusion shall be 0.07mm total in excess

of the lead width dimension at maximum material condition.

5. Dimension is the length of terminal for soldering to a substrate.

6. Dimension on SECTION B-B’ applies to the flat section of the

lead between 0.08mm and 0.15mm from the lead tip.

7. Formed lead shall be planar with respect to one another with

0.076mm at seating plane.

Marking:

Top marking :

Bottom marking:

see note 2

see note 5

12° REF.

TYP.

0.35

+0.05

- 0.10

0.30

0.45

0.10 R.

MIN.

4°

+/-4

0.10 R.

MIN.

see note 6

SEATING PLANE

TOP VIEW

END VIEW

SIDE VIEW

Hall plate location

Remarks:

1. All dimensions are in millimeters

TOP VIEW

END VIEW

Package line

0.275 TYP

1.45

+/-0.12

Pin 1

XXX - last three digits of the lot

Date code - WW - calender week

Date code - YY - calender year

Pin 1

3901090290

Page 13 of 14

Data Sheet

Rev 001

October 2014