IS1678 datasheet(41/54 Pages) MICROCHIP

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 2016 Microchip Technology Inc.

Advance Information

DS60001386A-Page 41

IS1678

9.0

REFLOW PROFILE AND

STORAGE CONDITION

This chapter describes reflow profiles and stencil infor-

mation of the IS1678 SoC, see Figure 9-1 and

Figure 9-2.

9.1

Stencil of SMT Assembly

Suggestion

9.1.1

STENCIL TYPE & THICKNESS

• Laser cutting

• Stainless steel

• Thickness: 0.5 mm Pitch, thickness more than

0.15 mm

9.1.2

APERTURE SIZE AND SHAPE FOR

TERMINAL PAD

• Aspect ratio (width/thickness) more than 1.5

• Aperture shape

- The stencil aperture is designed to match the

pad size on the PCB.

- Oval-shape opening should be used to get

the optimum paste release.

- Rounded corners to minimize clogging.

- Positive taper walls (5

° tapering) with bottom

opening larger than the top.

9.1.3

APERTURE DESIGN FOR THERMAL

PAD

• Small multiple openings should be used instead

of one big opening.

• 60~80% solder paste coverage

• Rounded corners to minimize clogging

• Positive taper walls (5° tapering) with bottom

opening larger than the top

FIGURE 9-1:

REFLOW PROFILE

FIGURE 9-2:

STENCIL TYPE

Do not recommend

Recommend

Coverage 91%

Coverage 77%

Coverage 65%

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