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LMV921 Datasheet(PDF) 34 Page - National Semiconductor (TI) |
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LMV921 Datasheet(HTML) 34 Page - National Semiconductor (TI) |
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34 / 42 page  4-1 LMV921 Qualification Package 4.0 PACKAGING INFORMATION 4.1 Package Material Generic Package Type 5 Lead SOT23 5 Lead SC-70 NS Package Number MA05B MAA005B Package/Compound Epoxy Cresol Novolac Epoxy Cresol Novolac Manufacturer Sumitomo Sumitomo Package/Compound Sumitomo EME-6710 Nitto MP-8000C Manufacturer’s Designation NSC B18 Lead Frame Material Copper Copper Lead Frame Manufacturer NSC-DCI Enomoto External Lead Frame Coating Solder Plate Solder Plate Sn/Pb Sn/Pb Pins Gull Wing 6mils Thick Gull Wing 6mils Thick Die Attach Method Eutectic, Cr/Ag/Sn Eutectic, Cr/Ag/Sn Bond Wire Gold, 1.0 mils Gold, 1.0 mils Bond Type Hot Thermosonic Ball Hot Thermosonic Ball Package Thermal 265°C/W 478°C/W |
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