High Temperature

Chip Resistor

HTCR Series

Hightemperatureoperationto250°C

Forgoldwirebond(Gtype)

Forconductiveadhesive(G,P&Etypes)

Forsoldering(Ftype)

Non-magnetic(G,P&Etypes)

Range0805to2512at1R0to10M

RoHScompliant

High Temperature Chip Resistor

HTCR Series

•

High temperature operation to 250°C

•

For gold wire bond (G type)

•

For conductive adhesive (G, P & EW types)

•

For soldering (F type)

•

Non-magnetic (G, P & EW types)

•

Range 0805 to 2512 at 1R0 to 10M

•

RoHS compliant

Electrical Data

Size

0805

1206

2010

2512

Power @230°C (G&P only)

W

0.063

0.125

0.25

0.5

Power @155°C

W

0.1

0.2

0.5

0.75

Power @70°C

W

0.125

0.25

0.625

1

Resistance range

ohms

1R0 to 10M

Tolerance

%

1, 5

LEV

V

150

200

400

500

TCR

ppm/°C

<10R:200 ≥10R:100

Operating temperature

°

C

F type -55 to +200,

E type -55 to +225,

G&P type -55 to +250

Thermal Impedance

°

C/W

220

160

75

40

Values

E24 or E96 preferred - other values to special order

L

W

T

A & C

Wt.

0805

2.0

+0.2/-0.15

1.25

±

0.15

0.5

±

0.15

0.4

±

0.2

0.009

1206

3.15

+0.2/-0.2

1.6

±

0.15

0.5

±

0.15

0.45

±

0.2

0.020

2010

5.0

±

0.2

2.5

±

0.2

0.65

±

0.15

0.5

+0.25/-0.3

0.036

2512

6.25

±

0.25

3.2

±

0.2

0.65

±

0.15

0.6

+0.25/-0.3

0.055

G & P types

E & F types

Construction

Planar gold G type or PtAg P types: Electrodes, resistor material and overglaze are printed onto an alumina

substrate. The resistors are laser trimmed to the required value and protected. The gold terminations are

suitable for wire bonding and both types are suitable for attachment with conductive adhesive.

Wraparound E type: Thick-film PtAg electrodes, resistor material and overglaze are printed onto an alumina

substrate. The resistors are laser trimmed to the required value and protected. The terminations are wraparound

coated with a polymer Ag material and are suitable for attachment with conductive adhesive.

Wraparound F type: These are made as the E type then plated with a nickel barrier and 100% tin plating and are

suitable for soldering.

Marking

The components are not marked; all data is printed onto the packaging.

Solvent Resistance

The component is resistant to all normal industrial cleaning solvents suitable for printed circuits.

General Note

02.10

Welwyn Components reserves the right to make changes in product specification without notice or liability

All information is subject to Welwyn’s own data and is considered accurate at time of going to print.



Telephone: +44 (0) 1670 822181 • Facsimile: +44 (0) 1670 829465 • Email: info@welwyn-tt.com • Website: www.welwyn-tt.com

T

W

L

Wrap-around terminations

(3 faces)

High Temperature Chip Resistor

HTCR Series

•

High temperature operation to 250°C

•

For gold wire bond (G type)

•

For conductive adhesive (G, P & EW types)

•

For soldering (F type)

•

Non-magnetic (G, P & EW types)

•

Range 0805 to 2512 at 1R0 to 10M

•

RoHS compliant

Electrical Data

Size

0805

1206

2010

2512

Power @230°C (G&P only)

W

0.063

0.125

0.25

0.5

Power @155°C

W

0.1

0.2

0.5

0.75

Power @70°C

W

0.125

0.25

0.625

1

Resistance range

ohms

1R0 to 10M

Tolerance

%

1, 5

LEV

V

150

200

400

500

TCR

ppm/°C

<10R:200 ≥10R:100

Operating temperature

°

C

F type -55 to +200,

E type -55 to +225,

G&P type -55 to +250

Thermal Impedance

°

C/W

220

160

75

40

Values

E24 or E96 preferred - other values to special order

L

W

T

A & C

Wt.

0805

2.0

+0.2/-0.15

1.25

±

0.15

0.5

±

0.15

0.4

±

0.2

0.009

1206

3.15

+0.2/-0.2

1.6

±

0.15

0.5

±

0.15

0.45

±

0.2

0.020

2010

5.0

±

0.2

2.5

±

0.2

0.65

±

0.15

0.5

+0.25/-0.3

0.036

2512

6.25

±

0.25

3.2

±

0.2

0.65

±

0.15

0.6

+0.25/-0.3

0.055

G & P types

E & F types

Construction

Planar gold G type or PtAg P types: Electrodes, resistor material and overglaze are printed onto an alumina

substrate. The resistors are laser trimmed to the required value and protected. The gold terminations are

suitable for wire bonding and both types are suitable for attachment with conductive adhesive.

Wraparound E type: Thick-film PtAg electrodes, resistor material and overglaze are printed onto an alumina

substrate. The resistors are laser trimmed to the required value and protected. The terminations are wraparound

coated with a polymer Ag material and are suitable for attachment with conductive adhesive.

Wraparound F type: These are made as the E type then plated with a nickel barrier and 100% tin plating and are

suitable for soldering.

Marking

The components are not marked; all data is printed onto the packaging.

Solvent Resistance

The component is resistant to all normal industrial cleaning solvents suitable for printed circuits.

General Note

02.10

Welwyn Components reserves the right to make changes in product specification without notice or liability

All information is subject to Welwyn’s own data and is considered accurate at time of going to print.



Telephone: +44 (0) 1670 822181 • Facsimile: +44 (0) 1670 829465 • Email: info@welwyn-tt.com • Website: www.welwyn-tt.com

T

W

L

Wrap-around terminations

(3 faces)

Make Possible

Resistors

09.14

General Note

TT Electronics reserves the right to make changes in product specification without notice or liability.

All information is subject to TT Electronics’ own data and is considered accurate at time of going to print.

© TT Electronics plc

www.ttelectronicsresistors.com

AllpartsarePb-freeandcomplywithEUDirective2011/65/EU(RoHS2)