PA03 • PA03A

PA03U

1

PA03, PA03A

FEATURES

•MO-127COPPERPOWERDIP™PACKAGE

•HIGHINTERNALPOWERDISSIPATION

—500watts

•HIGHVOLTAGEOPERATION—±75V

•VERYHIGHCURRENT—±30amps

•INTERNALSOAPROTECTION

•OUTPUTSWINGSCLOSETOSUPPLYRAILS

•EXTERNALSHUTDOWNCONTROL

APPLICATIONS

•LINEARANDROTARYMOTORDRIVES

•YOKE/MAGNETICFIELDDEFLECTION

•PROGRAMMABLEPOWERSUPPLIESto±68V

•TRANSDUCER/AUDIOTO1000W

DESCRIPTION

The super power PA03 advances the state of the art in

both brute force power and self protection against abnormal

operating conditions. Its features start with a copper dip pack-

age developed by Apex Microtechnology to extend power

capabilities well beyond those attainable with the familiar

TO-3 package. The increased pin count of the new package

provides additional control features, while the superior thermal

conductivity of copper allows substantially higher power ratings.

The PA03 incorporates innovative current limiting circuits

limiting internal power dissipation to a curve approximating

the safe operating area of the power transistors. The internal

current limit of 35A is supplemented with thermal sensing

which reduces the current limit as the substrate temperature

rises. Furthermore, a subcircuit monitors actual junction

temperatures and with a response time of less than ten mil-

liseconds reduces the current limit further to keep the junction

temperature at 175°C.

The PA03 also features a laser trimmed high performance

FET input stage providing superior DC accuracies both initially

and over the full temperature range.

EQUIVALENT

SCHEMATIC

3

4

5

2

1

12

11

8

7

6

9

10

–V

+

–

BAL

BAL

+V

Q31

Q20

A

Q17

Q2

Q3

Q5

Q20

B

Q18

+SHUT

DOWN

–SHUT

DOWN

Q14

Q22

COMP

Q12

D1

Q1

Q6 Q7

Q19

Q29 Q30

Q34

Q32

Q26

D3

OUT

Q9

D2

Q16

Q4

D4

+

–

Q24

The PA03 output power stages contain fast reverse recovery

diodes for sustained high energy flyback protection.

This hybrid integrated circuit utilizes thick film resistors,

ceramic capacitors and silicon semiconductors to maximize

reliability, minimize size and give top performance. Ultra-

sonically bonded aluminum wires provide reliable intercon-

nections at all operating temperatures. The MO-127 Copper,

12-pin Power Dip™ package (see Package Outlines), is

hermetically sealed and isolated from the internal circuits.

Insulating washers are not recommended.

IMPORTANT: Observe mounting precautions.

TYPICALAPPLICATION

POSITION

FEEDBACK

OBJECT

TOOL

SHUT DOWN

+5V

+

+S

–S

–

R2

0/10V

R1

PA03

DESIRED

POSITION

DAC

12-PINDIP

PACKAGESTYLECU

Power Operational Amplifiers

PA03 • PA03A

Copyright © Apex Microtechnology, Inc. 2012

(All Rights Reserved)

www.apexanalog.com

SEP 2012

PA03U REVL