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SiM3U1 Datasheet(PDF) 1 Page - Silicon Laboratories |
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SiM3U1 Datasheet(HTML) 1 Page - Silicon Laboratories |
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1 / 4 page ![]() Process Change Notice #1211201 ____________________________________________________________________________________________________ W7206F1 Process Change Notice Form rev AH The information contained in this document is PROPRIETARY to Silicon Laboratories, Inc. and shall not be reproduced or used in part or whole without Silicon Laboratories’ written consent. The document is uncontrolled if printed or electronically saved. Pg 1 User Registration Register today to create your account on Silabs.com. Your personalized profile allows you to receive technical document updates, new product announcements, “how-to” and design documents, product change notices (PCN) and other valuable content available only to registered users. http://www.silabs.com/profile PCN Date: 11/20/2012 Effective Date: 2/26/2013 Title: SiM3U1xx and SiM3C1xx Datasheet v1.0 Availablity Originator: Shahram Tadayon Phone: 512 428 1698 Dept: Marketing Customer Contact: Kathy Haggar Phone: 512 532 5261 Dept: Sales PCN Type: Datasheet Foundry Packing Product Revision Assembly Labeling Discontinuance Test Other Last Order Date: Not Applicable PCN Details Description of Change: Version 1.0 of the SiM3U1xx and SiM3C1xx datasheets and Reference Manual are now available. This update applies to the SiM3U1xx family of 32-bit USB MCUs and SiM3C1xx family of 32-bit broad based MCUs, including all parts beginning with the SiM3U1 and SiM3C1 base part number. See Appendix for complete description of the changes. The SiM3U1xx and SiM3C1xx 1.0 datasheets are available at www.silabs.com This change also includes an improvement in Moisture Sensitivity Level (MSL) from level 3 to level 2 for the 80 TQFP, 64 TQFP, 64 QFN, and 40 QFN package options. Reason for Change: The SiM3U1xx and SiM3C1xx v1.0 datasheets includes minor updates, additions and corrections to the specifications and text descriptions, as noted in the Appendix. The MSL change includes an improved manufacturing exposure time. These changes were made based on completion of device characterization and release to full production. Impact on Form, Fit, Function, Quality, Reliability: There is no impact on form, fit, quality and reliability. Functional changes were made to the DEVICEID0 registers to enhance device identification information. |
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