TAS5110A

SLES079A – APRIL 2003 – REVISED MAY 2003

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THERMAL INFORMATION

Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220 type

packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,

however, have two shortcomings: they do not address the low profile requirements (<2 mm) of many of today’s

advanced systems, and they do not offer a terminal count that is high enough to accommodate increasing integration.

On the other hand, traditional low-power surface-mount packages require power-dissipation derating that severely

limits the usable range of many high-performance analog circuits.

The PowerPAD package (thermally enhanced HTSSOP) combines fine-pitch surface-mount technology with thermal

performance comparable to much larger power packages.

The PowerPAD package is designed to optimize the heat transfer to the PCB. Because of the very small size and

limited mass of a HTSSOP package, thermal enhancement is achieved by improving the thermal conduction paths

that remove heat from the component. The thermal pad is formed using a patented lead-frame design and

manufacturing technique to provide a direct connection to the heat-generating IC. When this pad is soldered or

otherwise thermally coupled to an external heat dissipater, high power dissipation in the ultrathin, fine-pitch,

surface-mount package can be reliably achieved. See the dissipation derating table.

DIE

End View DAD

Thermal

Pad

Top View DAD

DAD Package

Figure 6. View of Thermally Enhanced DAD Package