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Version 1.40 |12 Aug 2016 | 31005AEN

PixArt Imaging Inc. http://www.pixart.com

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PixArt Imaging Inc.

PMW3325DB-TWV1 General Datasheet

Optical Gaming Navigation Chip

4.2

PCB Assembly Recommendation

1. Insert the integrated chip and all other electrical components into PCB.

2. Wave-solder the entire assembly in a no-wash solder process utilizing solder-fixture. A solder-fixture is required to

protect the chip from flux spray and wave solder.

3. Avoid getting any solder flux onto the chip body as there is potential for flux to seep into the chip package. The solder

fixture should be designed to expose only the chip leads to flux spray & molten solder while shielding the chip body and

optical apertures. The fixture should also set the chip at the correct position and height on the PCB.

4. Place the lens onto the base plate. Care must be taken to avoid contamination on the optical surfaces.

5. Remove the protective kapton tapes from optical apertures of the chip. Care must be taken to prevent contaminants

from entering the apertures. Do not place the PCB with the chip facing up during the entire product assembly process.

Hold the PCB vertically when removing kapton tape.

6. Insert PCB assembly over the lens onto the base plate aligning post to retain PCB assembly. The chip package will self-

align to the lens via the guide posts. The optical position reference for the PCB is set by the base plate and lens. Note

that the PCB motion due to button presses must be minimized to maintain optical alignment.

7. Install mouse top case. There must be a feature in the top case to press down onto the PCB assembly to ensure all

components are stacked or interlocked to the correct vertical height