MAX3293 datasheet(3/8 Pages) MAXIM

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II. Manufacturing Information

A. Description/Function:

20Mbps, +3.3V, SOT23 RS-485/RS-422 Transmitters

B. Process:

B8 (Standard 0.8 micron silicon gate CMOS)

C. Number of Device Transistors:

263

D. Fabrication Location:

California, USA

E. Assembly Location:

Malaysia, Philippines or Thailand

F. Date of Initial Production:

January, 2003

III. Packaging Information

A. Package Type:

6-Lead SOT

B. Lead Frame:

Copper

C. Lead Finish:

Solder Plate

D. Die Attach:

Non-Conductive Epoxy

E. Bondwire:

Gold (1 mil dia.)

F. Mold Material:

Epoxy with silica filler

G. Assembly Diagram:

# 05-9000-0352

H. Flammability Rating:

Class UL94-V0

I. Classification of Moisture Sensitivity

per JEDEC standard JESD22-112:

Level 1

IV. Die Information

A. Dimensions:

75 x 45 mils

B. Passivation:

Si3N4/SiO2 (Silicon nitride/ Silicon dioxide)

C. Interconnect:

Aluminum/Si (Si = 1%)

D. Backside Metallization:

None

E. Minimum Metal Width:

0.8 microns (as drawn)

F. Minimum Metal Spacing:

0.8 microns (as drawn)

G. Bondpad Dimensions:

5 mil. Sq.

H. Isolation Dielectric:

SiO2

I. Die Separation Method:

Wafer Saw

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