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LM79 Datasheet(PDF) 9 Page - National Semiconductor (TI)

[Old version datasheet] Texas Instruments acquired National semiconductor. Click here to check the latest version.
Part # LM79
Description  Microprocessor System Hardware Monitor
PDF  31 Pages
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Manufacturer  NSC [National Semiconductor (TI)]
Direct Link  http://www.national.com
Logo NSC - National Semiconductor (TI)

LM79 Datasheet(HTML) 9 Page - National Semiconductor (TI)

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AC Electrical Characteristics (Note 13) The following specifications apply for +4.25 V
DC ≤ VCC
+5.75 VDC unless otherwise specified. Boldface limits apply for TA =TJ =TMIN to TMAX; all other limits TA =TJ =
25˚C. (Continued)
Symbol
Parameter
Conditions
Typical
Limits
Units
(Note 8)
(Note 9)
(Limits)
SERIAL BUS TIMING CHARACTERISTICS
t
1
SCL (Clock) Period
2.5
µs (min)
t
2
Data In Setup Time to SCL High
100
ns (min)
t
3
Data Out Stable After SCL Low
0
ns (min)
t
4
SDA Low Setup Time to SCL Low (start)
100
ns (min)
t
5
SDA High Hold Time After SCL High (stop)
100
ns (min)
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
functional, but do not guarantee specific performance limits. For guaranteed specifications and test conditions, see the Electrical Characteristics. The guaranteed
specifications apply only for the test conditions listed. Some performance characteristics may degrade when the device is not operated under the listed test
conditions.
Note 2: All voltages are measured with respect to GND, unless otherwise specified
Note 3: When the input voltage (VIN) at any pin exceeds the power supplies (VIN< (GNDD or GNDA) or VIN >VCC), the current at that pin should be limited to 5 mA.
The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input current of 5 mA to four.
Note 4: The maximum power dissipation must be derated at elevated temperatures and is dictated by TJmax, θJA and the ambient temperature, TA. The maximum
allowable power dissipation at any temperature is PD =(TJmax−T A)/θJA.
Note 5: The human body model is a 100 pF capacitor discharged through a 1.5 k
Ω resistor into each pin. The machine model is a 200 pF capacitor discharged
directly into each pin.
Note 6: See the section titled “Surface Mount” found in any post 1986 National Semiconductor Linear Data Book for other methods of soldering surface mount
devices.
Note 7: Each input and output is protected by a nominal 6.5V breakdown voltage zener diode to GND; as shown below, input voltage magnitude up to 0.3V above
VCC or 0.3V below GND will not damage the LM79. There are parasitic diodes that exist between the inputs and the power supply rails. Errors in the ADC conversion
can occur if these diodes are forward biased by more than 50 mV. As an example, if VCC is 4.50 VDC, input voltage must be ≤ 4.55 VDC, to ensure accurate
conversions.
DS100036-6
FIGURE 3. Serial Bus Timing Diagram
www.national.com
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