Thermal Gap Filler

FEATURES AND BENEFITS

• Thermal conductivity 5.0 W/mK

• Highly compliant

• Low thermal resistance even at low

pressure

• Available in thicknesses from 0.020” thru

0.200” (0.5mm thru 5.0mm)

• Naturally tacky for adhesion during

assembly and transport

HIGHEST THERMAL CONDUCTIVITY COMPLIANT GAP FILLER

Tflex™ 700 is a 5 W/mK soft gap filler thermal interface material with great thermal

performance and high compliancy. The soft interface pad conforms to component topography,

resulting in little or no stress on the components and mating chassis or parts.

Unique silicone and ceramic filler technology allows a combination of high compliancy and

high thermal performance. Tflex™ 700 is stable from -45ºC thru 200ºC and meets UL 94V0

flame rating. Naturally tacky, it requires no additional adhesive coating which inhibits thermal

performance.

APPLICATIONS

• Cooling components to chassis, frame

or other mating components

• Mass storage devices

• Heat pipe thermal solutions for notebook

computers

• Automotive engine control

• Telecommunication hardware

• LED solid state lighting

• Power electronics

• Flat panel displays

• Audio and video components

• Computer servers and other IT infrastructure

• GPS navigation and other portable devices

Americas: +1.800.843.4556

Europe: +49.8031.24600

Asia: +86.755.2714.116

CLV-customerservice@lairdtech.com