Eccostock®LoK

Low Loss, Low Dielectric Constant Plastic

LOW LOSS LOW-K DIELECTRIC MATERIAL

Eccostock LoK is a low dielectric constant, low loss and low weight thermosetting plastic for RF and

microwave insulation. It weighs only about half that of polystyrene and one quarter that of

polytetrafluorethylene.

Eccostock LoK has better dimensional stability than other low loss plastics. It will not cold flow, nor

will it flow when heat is applied. Soldering iron temperatures will not soften Eccostock LoK, only

slightly degrade in the immediate area of contact.

It is completely unicellular and is unaffected by moisture.

FEATURES AND BENEFITS

MARKETS

SPECIFICATIONS

TYPICAL PROPERTIES

ECCOSTOCK LOK

Temperature Range °C (°F)

-70 to 150 (-94 to 302)

Frequency

60 Hz to 10 Ghz

Density g/cc

0.54

Dielectric Constant

1.7

Dielectric Strength, volts/mil (kv/mm)

300 (11.8)

Dissipation Factor

<0.004

Volume Resistivity, ohm-cm

10

14

Flexural Strength, kg/cm

420 (6,000)

Coefficient of Linear Expansion, per°C (°F)

50 x 10

Thermal Conductivity W/mK

0.4

Water absorption (%gain in 24h at 25°C)

0.1

Data for design engineer guidance only. Observed performance varies in application. Engineers are

reminded to test the material in application.

APPLICATIONS

problems. Due to the low dielectric constant, reflections in transmission lines are minimized.

plastic stock.

Americas: +1.866.928.8181

Europe: +49.(0)8031.2460.0

Asia: +86.755.2714.1166

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