Thermal Gap Filler

FEATURES AND BENEFITS

• Silicone-free gap filler

• Thermal Conductivity of 7.8 W/mK

• Exceptionally low thermal resistance

• Available in thicknesses from 0.020-inch

(0.50mm) through 0.040-inch (1.00mm)

in 0.010-inch increments

• RoHS Compliant

HIGHEST THERMAL CONDUCTIVITY SILICONE-FREE

GAP FILLER AVAILABLE

Tflex™ SF800 is a high-performance, compliant, silicone free thermal interface material.

By coupling extremely high thermal conductivity with exceptional wetting characteristics, Tflex™

SF800 provides some of the lowest thermal resistance values in the industry. This makes it

well-suited for applications where silicone based pads are traditionally used as well as those

applications which are silicone sensitive.

Tflex™ SF800 is naturally tacky on both sides requiring no additional adhesive coating, which

would inhibit thermal performance. The natural tack allows for the pad to be held in place

during assembly.

APPLICATIONS

• Silicone-sensitive applications

• Automotive applications

• Optical components

• Flat panel displays

• Hard disk drives

• Medical devices

• Laser equipment

• Aerospace electronics

• Solar energy

Americas: +1.800.843.4556

Europe: +49.8031.24600

Asia: +86.755.2714.116

CLV-customerservice@lairdtech.com