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Characteristic Curves (TA=25

unless otherwise noted)

℃

Fig.1 Peak Pulse Power Rating

Fig.2 Power Derating Curve

Fig.3 Pulse Waveform

Fig.4 AC Line Protection Application

0

0

1.0

2.0

4.0

3.0

10/1000 sec Waveform

μ.

as defined by R.E.A

Half Value

2

tr=10uS

Peak Value

T=25

J

℃

Pulse width(td) is defined

ad the Point where the Peak

50

100

150

t-Time(mS)

td

025

50

75

100 125 150 175 200

0

25

50

75

100

T -Lead Temperature(

)

L

℃

0.1

μs

10

μs

10ms

0.1

10

30

td - Pulse Width (sec.)

1

1.0

μs

100

μs

1.0m

s

Non-Repetitive Pulse

Waveform shown in Fig. 3

TA = 25 °C

td

td

td

P

P

P

Square

Half SINE

Exponentia

Peak Power

(single pulse)

Average Power

Low Capacitance

TVS

Application Note: Device must be used

with two units in parallel,opposite in polarity

as shown in circuit for AC signal line

protection.

Recommended Soldering Conditions

Recommended Conditions

Reflow Soldering

Time

25

time to peak temperature

(t 25

to peak)

℃

T (min)

s

T (max)

s

Preheat

Ramp-down

Ramp-up

Critical Zone

Tto T

LP

Re”ow Condition

Pb-Free assembly

(see Fig.1)

Pre Heat

-Temperature Min(T

)

s(min)

-Temperature Max(T

)

s(max)

-Time(Min to Max)(t )

s

Average ramp up rate

(Liquidus Temp(T ) to peak)

L

T

to T -Ramp-up Rate

s(max)

L

Re”ow

-Temperature(T )(Liquidus)

L

-Temperature(t )

L

Peak Temp(T )

P

Time within 5

of actual Peak Temp(t )

℃

P

Ramp-down Rate

Time 25

to Peak Temp(T )

℃

P

Do not exceed

+150

℃

+200

℃

60-180secs

3

/sec.Max.

℃

3

/sec.Max.

℃

+217

℃

60-150secs

+260(+0/-5)

℃

30 secs.Max.

6

/sec.Max.

℃

8 min.Max.

+260

℃

SAC(500W) Series

REV 2016 08 10