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SSD1828Z Datasheet(PDF) 9 Page - List of Unclassifed Manufacturers |
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SSD1828Z Datasheet(HTML) 9 Page - List of Unclassifed Manufacturers |
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9 / 43 page ![]() SSD1828 Rev 1.10 07/2002 SOLOMON 4 5 DIE Arrangement Figure 2 – SSD1828 Pin Assignment Die size (with scribe): 9.6 x 1.6 mm 2 Die Thickness: 534±25µm Bump Height: Typical 18µm Bump co-planarity <3µm (within die) Pad1 Pad123 Pad142 Pad270 Note: 1. Diagram showing the die face up. 2. Coordinates are reference to center of the chip. 3. Unit of coordinates and Size of all alignment marks are in um. 4. All alignment keys do not contain gold bump. TEST13 TEST12 TEST11 MIO CL NOBUMP TEST9 VL5 VL4 VL3 VL2 TEST8 TEST7 TEST6 TEST5 VOUT : : VOUT VSS : : VSS RVSS CVSS : : CVSS VCI : : VCI VDD : : VDD D7 (SDA) D7 (SDA) D6 (SCK) D6 (SCK) D5 D4 D3 D2 D1 D0 VDD E (RD#) E (RD#) R/W (WR#) R/W (WR#) VSS D/C D/C D/C /RES VDD /CS /CS VSS PS1 VDD VSS PS0 VDD TEST4 TEST3 TEST2 TEST1 VSS VSS VSS VSS VSS VSS VSS VSS VSS NOBUMP VSS VSS VSS VSS VSS VSS VSS COM18 COM17 COM16 : : : : : COM0 COMSR SEG0 SEG1 SEG2 : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : : SEG94 SEG95 COM32 COM33 COM34 : : : : : COM43 COM44 } } } } } 15 x VOUT 7 x VSS 16 x VCI 12 x CVSS 7 x VDD |
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