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AM29LV256M Datasheet(PDF) 63 Page - Advanced Micro Devices |
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AM29LV256M Datasheet(HTML) 63 Page - Advanced Micro Devices |
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63 / 70 page ![]() September 15, 2003 Am29LV256M 61 D A T A SH EET ERASE AND PROGRAMMING PERFORMANCE Notes: 1. Typical program and erase times assume the following conditions: 25 °C, 3.0 V V CC. Programming specifications assume that all bits are programmed to 00h. 2. Maximum values are measured at VCC = 3.0, worst case temperature. Maximum values are valid up to and including 100,000 program/erase cycles. 3. Byte/Word programming specification is based upon a single word/byte programming operation not utilizing the write buffer. 4. For 1-16 words or 1-32 bytes programmed in a single write buffer programming operation. 5. Effective write buffer specification is based upon a 16-word/32-byte write buffer operation. 6. In the pre-programming step of the Embedded Erase algorithm, all bits are programmed to 00h before erasure. 7. System-level overhead is the time required to execute the two- or four-bus-cycle sequence for the program command. See Table 11 for further information on command definitions. 8. The device has a minimum erase and program cycle endurance of 100,000 cycles. TSOP PIN AND BGA PACKAGE CAPACITANCE Notes: 1. Sampled, not 100% tested. 2. Test conditions T A = 25°C, f = 1.0 MHz. Parameter Typ (Note 1) Max (Note 2) Unit Comments Sector Erase Time 0.5 3.5 sec Excludes 00h programming prior to erasure (Note 6) Chip Erase Time 256 512 sec Single Byte/Word Program Time (Note 3) Byte 60 600 µs Excludes system level overhead (Note 7) Word 60 600 µs Accelerated Single Byte/Word Program Time (Note 3) Byte 54 540 µs Word 54 540 µs Total Write Buffer Program Time (Note 4) 240 1200 µs Effective Write Buffer Program Time (Note 5) Per Byte 7.5 38 µs Per Word 15 75 µs Total Accelerated Write Buffer Program Time (Note 4) 200 1040 µs Effective Accelerated Write Buffer Program Time (Note 5) Per Byte 6.25 33 µs Per Word 12.5 65 µs Chip Program Time 252 584 sec Parameter Symbol Parameter Description Test Setup Typ Max Unit C IN Input Capacitance V IN = 0 TSOP 6 7.5 pF BGA 4.2 5 pF C OUT Output Capacitance V OUT = 0 TSOP 8.5 12 pF BGA 5.4 6.5 pF C IN2 Control Pin Capacitance V IN = 0 TSOP 7.5 9 pF BGA 3.9 4.7 pF |
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