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LM4919 Datasheet(PDF) 12 Page - National Semiconductor (TI) |
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LM4919 Datasheet(HTML) 12 Page - National Semiconductor (TI) |
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12 / 15 page ![]() Application Information (Continued) POWER DISSIPATION Power dissipation is a major concern when designing a successful amplifier, whether the amplifier is bridged or single-ended. A direct consequence of the increased power delivered to the load by a bridge amplifier is an increase in internal power dissipation. Since the LM4919 has two opera- tional amplifiers in one package, the maximum internal power dissipation is 4 times that of a single-ended amplifier. The maximum power dissipation for a given BTL application can be derived from the power dissipation graphs or from Equation 1. P DMAX = 4*(VDD) 2 /(2 π2R L) (1) When operating in Single Ended mode, Equation 2 states the maximum power dissipation point for a single-ended amplifier operating at a given supply voltage and driving a specified output load. P DMAX =(VDD) 2 /(2 π2R L) (2) Since the LM4919 has two operational amplifiers in one package, the maximum internal power dissipation point is twice that of the number that results from Equation 2. From Equation 2, assuming a 1.5V power supply and a 16 Ω load, the maximum power dissipation point is 7mW per amplifier. Thus the maximum package dissipation point is 14mW. The maximum power dissipation point obtained from either Equations 1, 2 must not be greater than the power dissipa- tion that results from Equation 3: P DMAX =(TJMAX -TA)/ θ JA (3) For package MUB10A, θ JA = 175˚C/W. TJMAX = 150˚C for the LM4919. Depending on the ambient temperature, T A,of the system surroundings, Equation 3 can be used to find the maximum internal power dissipation supported by the IC packaging. If the result of Equation 1 or 2 is greater than that of Equation 3, then either the supply voltage must be de- creased, the load impedance increased or T A reduced. For the typical application of a 1.5V power supply, with a 16 Ω load, the maximum ambient temperature possible without violating the maximum junction temperature is approximately 146˚C provided that device operation is around the maxi- mum power dissipation point. Thus, for typical applications, power dissipation is not an issue. Power dissipation is a function of output power and thus, if typical operation is not around the maximum power dissipation point, the ambient temperature may be increased accordingly. Refer to the Typical Performance Characteristics curves for power dissi- pation information for lower output powers. POWER SUPPLY BYPASSING As with any amplifier, proper supply bypassing is important for low noise performance and high power supply rejection. The capacitor location on the power supply pins should be as close to the device as possible. Typical applications em- ploy a battery (or 1.5V regulator) with 10µF tantalum or electrolytic capacitor and a ceramic bypass capacitor that aid in supply stability. This does not eliminate the need for bypassing the supply nodes of the LM4919. A bypass ca- pacitor value in the range of 0.1µF to 1µF is recommended. MICRO POWER SHUTDOWN The voltage applied to the SHUTDOWN pin controls the LM4919’s shutdown function. Activate micro-power shut- down by applying a logic-low voltage to the SHUTDOWN pin. When active, the LM4919’s micro-power shutdown fea- ture turns off the amplifier’s bias circuitry, reducing the sup- ply current. The trigger point varies depending on supply voltage and is shown in the Shutdown Hysteresis Voltage graphs in the Typical Performance Characteristics section. The low 0.02µA (typ) shutdown current is achieved by ap- plying a voltage that is as near as ground as possible to the SHUTDOWN pin. A voltage that is higher than ground may increase the shutdown current. There are a few ways to control the micro-power shutdown. These include using a single-pole, single-throw switch, a microprocessor, or a mi- crocontroller. When using a switch, connect an external 100k Ω pull-up resistor between the SHUTDOWN pin and V DD. Connect the switch between the SHUTDOWN pin and ground. Select normal amplifier operation by opening the switch. Closing the switch connects the SHUTDOWN pin to ground, activating micro-power shutdown. The switch and resistor guarantee that the SHUTDOWN pin will not float. This prevents unwanted state changes. In a system with a microprocessor or microcontroller, use a digital output to apply the control voltage to the SHUTDOWN pin. Driving the SHUTDOWN pin with active circuitry eliminates the pull-up resistor. MUTE When in single ended mode, the LM4919 also features a mute function that enables extremely fast turn-on/turn-off with a minimum of output pop and click with a low current consumption ( ≤20µA, typical). The mute function leaves the outputs at their bias level, thus resulting in higher power consumption than shutdown mode, but also provides much faster turn on/off times. Providing a logic low signal on the MUTE pin enables mute mode. Threshold voltages and ac- tivation techniques match those given for the shutdown func- tion as well. Mute may not appear to function when the LM4919 is used to drive high impedance loads. This is because the LM4919 relies on a typical headphone load (16-32 Ω) to reduce input signal feed-through through the input and feedback resistors. Mute attenuation can thus be calculated by the following formula: Mute Attenuation (dB) = 20Log[R L / (Ri+RF)] Parallel load resistance may be necessary to achieve satis- factory mute levels when the application load is known to be high impedance. The mute function, described above, is not necessary when the LM4919 is operating in BTL mode since the shutdown function operates quickly in BTL mode with less power consumption than mute. In these modes, the Mute signal is equivalent to the Shutdown signal. Mute may be enabled during shutdown transitions, but should not be toggled for a brief period immediately after exiting or entering shutdown. These brief time periods are labeled X1 (time after returning from shutdown) and X2 (time after entering shutdown) and are shown in the timing diagram given in Figure 5. X1 occurs immediately following a return from shutdown (TWU) and lasts 40ms±25%. X2 occurs after the part is placed in shutdown and the decay of the bias voltage has occurred (2.2*250k*CB) and lasts for 100ms±25%. The timing of these transition periods relative to X1 and X2 is also shown in Figure 5. While in single ended mode, mute should not be toggled during these time periods, but may be toggled www.national.com 12 |
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