F2976 Datasheet

© 2017 Integrated Device Technology, Inc.

2

Rev O April 19, 2017

Pin Assignments

Figure 2.

Pin Assignments for 2mm x 2mm x 0.5mm 12-pin TQFN, NEG12 – Top View

RF1

GND

LS

GND

RFC

GND

F2976

GND

RF2

GND

GND

EP

Vcc

Pin Descriptions

Table 1.

Pin Descriptions

Number

Name

Description

1

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

2

RF2

RF2 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

3

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

4

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

5

RFC

RF Common Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

6

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

7

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

8

RF1

RF1 Port. If this pin is not 0V DC, then an external coupling capacitor must be used.

9

GND

Internally grounded. Connect pin directly to paddle ground or as close as possible to pin with thru vias.

10

Logic control pin (see Table 9).

11

LS

through a 500k resistor.

12

Power supply. Bypass to GND with capacitors shown in the Typical Application Circuit as close as

possible to pin.

EP

Exposed Pad. Internally connected to GND. Solder this exposed pad to a PCB pad that uses multiple

ground vias to provide heat transfer out of the device into the PCB ground planes. These multiple ground

vias are also required to achieve the specified RF performance.