4

TLV7011, TLV7021

SLVSDM5 – MAY 2017

www.ti.com

Product Folder Links: TLV7011 TLV7021

Submit Documentation Feedback

Copyright © 2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

Input terminals are diode-clamped to the power-supply rails. Input signals that can swing more than 0.3V beyond the supply rails must

be current-limited to 10mA or less.

(3)

Short-circuit to ground, one comparator per package.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

6

V

V

±10

mA

Output (OUT)

TLV7011

V

TLV7021

6

10

s

150

°C

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

Electrostatic

discharge

±1000

V

±250

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

1.4

5.5

V

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

TLV7011/TLV7021

UNIT

DPW (X2SON)

5 PINS

Junction-to-ambient thermal resistance

497.5

°C/W

Junction-to-case (top) thermal resistance

275.5

°C/W

Junction-to-board thermal resistance

372.2

°C/W

Junction-to-top characterization parameter

55.5

°C/W

Junction-to-board characterization parameter

370.3

°C/W

Junction-to-case (bottom) thermal resistance

165.1

°C/W