X76F100PI datasheet(15/16 Pages) XICOR

15 / 16 page

X76F100

Characteristics subject to change without notice.

15 of 16

REV 1.0 6/22/00

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PACKAGING INFORMATION

8 Pad Chip on Board Smart Card Module Type X

0.465 ± 0.002

(11.81 ± 0.05)

SECTION A-A

R. 0.078 (2.00)

0.285 (7.24) Max.

See Note 7 Sht. 2

0.420 ± 0.002

(10.67 ± 0.05)

0.210 ± 0.002

(5.33 ± 0.05)

0.105 ± 0.002

(2.67 ± 0.05) Typ.

(8x)

0.105 ± 0.002

(2.67 ± 0.05)

0.008 ± 0.001

(0.20 ± 0.03)

0.233 ± 0.002

(5.92 ± 0.05)

0.174 ± 0.002

(4.42 ± 0.05)

0.146 ± 0.002

(3.71 ± 0.05)

Die

0.0235 (0.60) Max.

0.015 (0.38) Max.

0.008 (0.20) Max.

Glob Size

FR4 Tape

See Detail Sheet 3

Copper, Nickel Plated, Gold Flash

R. 0.013 (0.33) (8x)

0.270 (6.86) Max.

0.069 (1.75) Min Epoxy

Free Area (Typ.)

0.088 (2.24) Min Epoxy

Free Area (Typ.)

NOTE: ALL DIMENSIONS IN INCHES AND (MILLIMETERS)

VCC

RST

SCL

VSS

SDA

See Note 7 Sht. 2

X76F100PI Datasheet(PDF) 15 Page - Xicor Inc.

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