10

DS734F5

5.4 Power Supply Characteristics

5.4 Power Supply Characteristics

(Measurements performed under operating conditions)

5.5 Thermal Data (48-pin LQFP)

Parameter

Symbol

Min

Typ

Max

Unit

High-level input voltage

2.0

—

—

V

Low-level input voltage, except XTI

——

0.8

V

Low-level input voltage, XTI

——

0.6

V

Input hysteresis

—0.4

—

V

VDDIO*0.9

—

—

V

——

VDDIO*0.1

V

Input leakage XTI

——

5

µA

Input leakage current (all digital pins with internal pull-up resistors enabled)

——

70

µA

Parameter

Min

Typ

Max

Unit

Operational Power Supply Current:

1.Dependent on application firmware and DSP clock speed.

—

203

—

mA

VDDA: PLL operating

—8

—

mA

VDDIO: With most ports operating

—27

—

mA

Total Operational Power Dissipation:

—

480

—

mW

Standby Power Supply Current:

VDD: Core and I/O not clocked

—

100

—

µA

VDDA: PLL halted

—1

—

µA

VDDIO: All connected I/O pins 3-stated by other ICs in system

—

50

—

µA

Total Standby Power Dissipation

—

348

—

µW

Parameter

Symbol

Min

Typ

Max

Unit

Junction Temperature

——

125

°C

Thermal Resistance (Junction to Ambient)

1.Two-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers.

2.Four-layer board is specified as a 76 mm X 114 mm, 1.6 mm thick FR-4 material with 1 oz. copper covering 20% of the top and bottom layers and 0.5

oz. copper covering 90 % of the internal power plane and ground plane layers.

θ

ja

—

63.5

—

°C/Watt

—54

—

Thermal Resistance (Junction to Top of Package)

3.To calculate the die temperature for a given power dissipation

T

θ

4.To calculate the case temperature for a given power dissipation

T

ψ

ψ

jt

—

0.70

—

°C/Watt

—0.64

—