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54

CWR11

Vishay Sprague

Document Number 40011

Revision 31-Jan-05

For technical questions, contact tantalum@vishay.com

RECOMMENDED MOUNTING PAD GEOMETRIES In inches [millimeters]

A

Pad Dimensions

Pad Dimensions

Case

Code

A

(Min.)

B

(Nom.)

C

(Nom.)

D

(Nom.)

E

(Nom.)

0.034

[0.87]

0.061

[1.54]

0.061

[1.54]

0.066

[1.68]

0.085

[2.15]

0.085

[2.15]

0.106

[2.70]

0.106

[2.70]

0.053

[1.35]

0.065

[1.65]

0.124

[3.15]

0.175

[4.45]

0.222

[5.65]

0.234

[5.95]

0.337

[9.55]

0.388

[9.85]

0.048

[1.23]

0.048

[1.23]

0.050

[1.28]

0.050

[1.28]

A

B

C

D

Case

Code

A

(Min.)

B

(Nom.)

C

(Nom.)

D

(Nom.)

E

(Nom.)

0.071

[1.80]

0.110

[2.80]

0.110

[2.80]

0.118

[3.00]

0.085

[2.15]

0.085

[2.15]

0.106

[2.70]

0.106

[2.70]

0.053

[1.35]

0.065

[1.65]

0.124

[3.15]

0.175

[4.45]

0.222

[5.65]

0.234

[5.95]

0.337

[9.55]

0.388

[9.85]

0.048

[1.23]

0.048

[1.23]

0.050

[1.28]

0.050

[1.28]

A

B

C

D

GUIDE TO APPLICATION (Continued)

D

A

C

B

E

D

B

E

C

Wave Solder Pads

Reflow Solder Pads

SOLDERING PROFILE

Recommended Solder Profile — Wave Solder

Recommended Solder Profile — Reflow

9.

Recommended Mounting Pad Geometries: Proper mounting pad geometries are essential for successful solder

connections. These dimensions are highly process sensitive and should be designed to minimize component rework

due to unacceptable solder joints. The dimensional configurations shown are the recommended pad geometries for both

wave and reflow soldering techniques. These dimensions are intended to be a starting point for circuit board designers

and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design.

Time (Seconds)

300

250

200

150

100

50

0

0

50

100

150

200

250

245

130

Time (Seconds)

300

250

200

150

100

50

0

0

50

100

150

200

250

300

250

200

150

100

50

0

Max. Recommended

260

130

5 - 10 Sec.

300

250

200

150

100

50

0