SPE-11-8-100/E/SS Page 8 of 10

7. Recommended Reflow Soldering Profile

AP.10G can be assembled following Pb-free assembly. According to the Standard

IPC/JEDEC J-STD-020C, the temperature profile suggested is as follow:

Phase

Profile Features

Pb-Free Assembly

(SnAgCu)

PREHEAT

Temperature Min(Tsmin)

Temperature Max(Tsmax)

Time(ts) from (Tsmin to Tsmax)

150°C

200°C

60-120 seconds

RAMP-UP

Avg. Ramp-up Rate (Tsmax to TP)

3°C/second(max)

REFLOW

Temperature(TL)

Total Time above TL (tL)

217°C

30-100 seconds

PEAK

Temperature(TP)

Time(tp)

260°C

2-5 seconds

RAMP-DOWN

Rate

3°C/second(max)

Time from 25°C to Peak Temperature

8 minutes max.

Composition of solder paste

96.5Sn/3Ag/0.5Cu

Solder Paste Model

SHENMAO PF606-P26