LMT87LP datasheet(5/29 Pages) TI1

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LMT87, LMT87-Q1

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SNIS170D – JANUARY 2014 – REVISED JUNE 2017

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7.4 Recommended Operating Conditions

MIN

MAX

UNIT

Specified temperature

TMIN ≤ TA ≤ TMAX

°C

−50 ≤ TA ≤ 150

°C

Supply voltage (VDD)

2.7

5.5

(1)

For information on self-heating and thermal response time see section Mounting and Thermal Conductivity.

(2)

For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report.

(3)

The junction to ambient thermal resistance (RθJA) under natural convection is obtained in a simulation on a JEDEC-standard, High-K

board as specified in JESD51-7, in an environment described in JESD51-2. Exposed pad packages assume that thermal vias are

included in the PCB, per JESD 51-5.

(4)

Changes in output due to self heating can be computed by multiplying the internal dissipation by the thermal resistance.

7.5 Thermal Information

(1)

THERMAL METRIC(2)

LMT87/

LMT87-Q1

LMT87LP

LMT87LPG

UNIT

DCK (SOT/SC70)

LP/LPM (TO-92)

LPG (TO-92S)

5 PINS

3 PINS

RθJA

Junction-to-ambient thermal resistance (3)(4)

275

167

130.4

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

64.2

°C/W

RθJB

Junction-to-board thermal resistance

146

106.2

°C/W

ψJT

Junction-to-top characterization parameter

1.2

14.6

°C/W

ψJB

Junction-to-board characterization parameter

146

106.2

°C/W

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