TMP303ADRLR datasheet(16/22 Pages) TI1

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HYSTSET0

HYSTSET1

GND

OUT

SOH

Heat Source

0.1 µF

VIA to Power Ground Plane

Ground Plane for

Thermal

Coupling to Heat

Source

Supply Voltage

Output

TMP303

SBOS486G – JULY 2009 – REVISED JULY 2017

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10 Power Supply Recommendations

The TMP303 family of devices is designed to operate from a single power supply within the range of 1.4 V to

3.6 V. No specific power supply sequencing with respect to any of the input or output pins is required.

11 Layout

11.1 Layout Guidelines

Mount the TMP303 to a PCB as shown in Figure 19. For this example the HYSTSET0 and HYSTSET1 pins are

connected directly to ground. Connecting these pins to ground configures the device for 1°C hysteresis. The

SOH pin is grounded in this layout. Leaving this pin floating has no effect on the behavior of the TMP303.

•

Bypass the VS pin to ground with a low-ESR ceramic bypass capacitor. The typical recommended bypass

capacitance is a 0.1-μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to

the VS and GND pins of the device. Take care in minimizing the loop area formed by the bypass-capacitor

connection, the VS pin, and the GND pin of the IC. Additional bypass capacitance can be added to

compensate for noisy or high-impedance power supplies.

•

The OUT pin is a push-pull, active-high output and does not require a pullup resistor to VS.

11.2 Layout Example

Figure 19. PCB Layout Example

TMP303ADRLR Datasheet(PDF) 16 Page - Texas Instruments