4

TMP303

SBOS486G – JULY 2009 – REVISED JULY 2017

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Copyright © 2009–2017, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1)

MIN

MAX

UNIT

3.6

V

Input Pins, Voltage

–0.5

V

Output Pin, Voltage

OUT

–0.5

V

Output Pin, Current

OUT

–55

8

mA

Operating Temperature

130

°C

150

°C

–60

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE

UNIT

Electrostatic discharge

±2000

V

Charged-device model (CDM), per JEDEC specification JESD22-

±1000

Machine model (MM)

±200

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

Power Supply Voltage

1.4

3.6

V

Specified Temperature Range

–40

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report, SPRA953.

7.4 Thermal Information

TMP303

UNIT

DRL (SOT-563)

6 PINS

Junction-to-ambient thermal resistance

168

°C/W

Junction-to-case (top) thermal resistance

2.4

°C/W

Junction-to-board thermal resistance

42.3

°C/W

Junction-to-top characterization parameter

0.9

°C/W

Junction-to-board characterization parameter

42.3

°C/W

Junction-to-case (bottom) thermal resistance

N/A

°C/W