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RT4730 Datasheet(PDF) 13 Page - Richtek Technology Corporation

Part # RT4730
Description  Power Solution for Wearable AMOLED Products
PDF  17 Pages
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Manufacturer  RICHTEK [Richtek Technology Corporation]
Direct Link  http://www.richtek.com
Logo RICHTEK - Richtek Technology Corporation

RT4730 Datasheet(HTML) 13 Page - Richtek Technology Corporation

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RT4730
13
DS4730-01
March 2017
www.richtek.com
©
Copyright
2017 Richtek Technology Corporation. All rights reserved.
is a registered trademark of Richtek Technology Corporation.
Application Information
The RT4730 is a highly integrated power solution with
Buck-Boost and inverting charge pump to generate positive
and negative output voltage for AMOLED bias. The Buck-
Boost DC-DC converter can operate with wide input voltage
from 2.9V to 4.8V. The converter feedback loop is internally
compensated for both Buck and Boost operation and it
provides seamless transition between Buck and Boost
modes operation.
Input Capacitor Selection
PVIN input ceramic capacitor with 4.7
μF capacitance and
AVIN input ceramic capacitor with 10
μF capacitance is
suggested for applications. For better voltage filtering,
select ceramic capacitors with low ESR, X5R and X7R
types are suitable because of their voltage and temperature
ranges.
Inductor Selection
The recommended power inductor is 1
μH. In applications,
need to select an inductor with the low DCR to provide
good performance and efficiency.
Output Capacitor Selection
The output capacitor selection determines the output
voltage ripple and transient response. It is recommended
to use ceramic capacitors placed as close as possible to
output and GND pins of the IC.
Under Voltage Lockout
The prevent abnormal operation of the IC in low voltage
condition, an under voltage lockout is included which shuts
down IC operation when input voltage is lower than the
specified threshold voltage.
Positive and Negative Output Voltage Setting
The positive and negative output voltage can be
programmed by a MCU through the dedicated pin
according to SWIRE pulse.
Over Current Protection
The RT4730 includes a cycle-by-cycle current limit function
which monitor the inductor current during each ON period.
The power switch will be forced off to avoid large current
damage once the current is over the limit level.
Short Circuit Protection
The RT4730 has an advanced output short-circuit protection
mechanism which prevents the IC from damage by
unexpected application. When the output becomes
shorted to ground, and the output voltage is under the
limit level, the IC enters shutdown mode and can only re-
start normal operation after re-power on.
Over Temperature Protection
The RT4730 equips an over temperature protection circuitry
to prevent overheating due to excessive power dissipation.
The OTP will shut down the bias operation when ambient
temperature exceeds 140
°C. Once the ambient
temperature cools down by approximately 10
°C, IC will
automatically resume normal operation. To maintain
continuous operation, the maximum junction temperature
should be prevented from rising above 130
°C.
Thermal Considerations
The junction temperature should never exceed the
absolute maximum junction temperature TJ(MAX), listed
under Absolute Maximum Ratings, to avoid permanent
damage to the device. The maximum allowable power
dissipation depends on the thermal resistance of the IC
package, the PCB layout, the rate of surrounding airflow,
and the difference between the junction and ambient
temperatures. The maximum power dissipation can be
calculated using the following formula :
PD(MAX) = (TJ(MAX)
− TA) / θJA
where TJ(MAX) is the maximum junction temperature, TAis
the ambient temperature, and
θJA is the junction-to-ambient
thermal resistance.
For continuous operation, the maximum operating junction
temperature indicated under Recommended Operating
Conditions is 125
°C. The junction-to-ambient thermal
resistance,
θJA, is highly package dependent. For a WL-
CSP-16B 2.34 x 2.34 (BSC), the thermal resistance,
θJA,
is 42.3
°C/W on a standard JEDEC 51-7 high effective-
thermal-conductivity four-layer test board. The maximum
power dissipation at TA = 25
°C can be calculated as below :
PD(MAX) = (125
°C − 25°C) / (42.3°C/W) = 2.36W for a
WL-CSP-16B 2.34 x 2.34 (BSC) package.



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