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S1212B Datasheet(PDF) 34 Page - Seiko Instruments Inc |
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S1212B Datasheet(HTML) 34 Page - Seiko Instruments Inc |
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34 / 58 page  (1) 1 2 3 4 (2) 1 2 3 4 (3) 1 2 3 4 Board A Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 2 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 - - 74.2 x 74.2 x t0.070 Thermal via - Board B Item Specification Size [mm] 114.3 x 76.2 x t1.6 Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 74.2 x 74.2 x t0.035 74.2 x 74.2 x t0.070 Thermal via - Item Specification Size [mm] 114.3 x 76.2 x t1.6 Thermal via Number: 4 Diameter: 0.3 mm Board C Material FR-4 Number of copper foil layer 4 Copper foil layer [mm] Land pattern and wiring for testing: t0.070 74.2 x 74.2 x t0.035 IC Mount Area enlarged view HTMSOP-8/HMSOP-8 Test Board No. HTMSOP8/HMSOP8-A-Board-SD-1.0 SII Semiconductor Corporation |
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