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IC-LSC Datasheet(PDF) 4 Page - IC-Haus GmbH |
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IC-LSC Datasheet(HTML) 4 Page - IC-Haus GmbH |
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4 / 8 page ![]() iC-LSC 12-CHANNEL ACTIVE PHOTOSENSOR ARRAY Rev C3, Page 4/8 PACKAGE DIMENSIONS oQFN32-5x5 All dimensions given in mm. Maximum molding excess +20 µm / -75 µm versus surface of glass/reticle. Maximum package thickness tolerance +/- 0.1 mm. 5 1.84 TOP SIDE 3.60 0.50 0.23 BOTTOM 3.60 0.50 0.30 4.90 R0.15 RECOMMENDED PCB-FOOTPRINT drb_lsc-oqfn32-2_pack_1, 10:1 |
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